I was recently presented with a unique opportunity to compare the results of full ANSYS CFD simulations with the results obtained using the new ANSYS Discovery Live product, which provides results instantly upon changing the geometry without interrupting a run. I was very pleased and surprised by the speed and accuracy of Discovery Live in this comparison test.
I work for Astec, Inc., the subsidiary of Astec Industries that builds asphalt plants. Roadtec Inc., another Astec Industries company, builds asphalt pavers, reclaimers and material transfer vehicles (MTVs). An MTV helps to accomplish non-stop, non-contact paving by offering a continuous supply of Hot Mix to the paver. By separating dump trucks from the paver this way, contractors are able to make a smoother finished road.
Getting power management right in the era of heterogeneous SoCs is a multi-pronged effort, there’s no getting around it. There are many technical avenues to managing the power in heterogenous SoCs today, as well as a few human ones.
Engineering teams daily try to squeeze more and more power from their designs, which many times includes adding human resources and expertise to the project.
Take an example where a design team leader gets the mandate to include high level synthesis in the design methodology.
As we announced recently, ANSYS and 3DSIM have joined forces to offer engineers, designers and machine operators the only end-to-end additive manufacturing (AM) simulation workflow in the world today. We call it simulation-driven additive manufacturing. The powerful combination of exaSIM and FLEX from 3DSIM with ANSYS Workbench and the full line of ANSYS solvers will give you unprecedented design-to-print capabilities for AM.
Why is this important? Because there are still challenges to be overcome in AM — especially for metals — to ensure that every part will be built successfully with full confidence in its design and functionality the first time through the AM process. Our aim is to ensure first build success through comprehensive simulation of all aspects of additive manufacturing, from machine setup to the microstructure of the metal to the structural integrity of the finished part. Continue reading →
The role of 3-D physics, systems simulation and embedded software is expanding rapidly into new industries and disciplines. A few years ago, 3-D physics simulation was limited to specific departments within organizations, and often these departments did not coordinate with each other on product development activities. Fast forward to today, and much has changed and must continue to evolve in order for companies to remain competitive in the changing landscape of product development. Integrated 3-D physics, systems simulation and embedded software tools are of the utmost importance — especially when tackling the challenges of quickly and accurately developing the technology driving digital twins and autonomous vehicles.
Join us in Paris for our Innovations Conference on December 5-6 and learn how our customers are using simulation to bring their products to market faster.
When designing heavy equipment such as bucket loaders, truck bodies and diggers, finite element analysis tools, such as ANSYS, are a ‘must-have’ in any design engineer toolkit in order to assess the structural integrity of designs and ensure their durability and performance. But while FEA will provide engineers with a wide range of tools for setting up meshes, joints, and boundary conditions, there is one thing missing in this analysis: the bulk material itself that the machine is supposed to handle! DEM (Discreet Element Method) offers additional capabilities to account for bulk materials.
We’re hiring! Check out the latest career opportunities listed here. All of our openings are listed on our careers site. So, if you do not see a position that fits your qualifications, take a look there. ANSYS only accepts applications via our careers site. Continue reading →
Chinook ETS is a team of student engineers from École de technologie supérieure in Montreal, Canada. We are trying to design and build a prototype wind-powered car with the highest possible efficiency for the Racing Aeolus event held in Den Helder, Netherlands. Our goal is not only to perform well during the race but also to develop efficient wind turbines through numeric simulations, new composites fabrication processes, advanced electronics and out-of-the-box thinking. ANSYS simulation solutions play a key role in our design efforts.Continue reading →
As electronic devices become smaller and more ubiquitous, the printed circuit boards and components that drive them face increasing power densities and evermore complexity. To ensure product reliability and performance, accurate and detailed analysis methodologies are necessary. In a three-part series, Mike Bak and I will discuss modeling approaches for the thermo-mechanical analysis of printed circuit boards and their components. In part one of this series, I will cover modeling approaches for the PCB itself.
A typical PCB will have multiple layers, each one having its own distribution of FR-4 and copper traces and vias. Take the board layout shown in Figure 1 as an example, which has over 16,000 traces and vias across 7 layers. The complex board geometry leads to spatially varying material properties (i.e. modulus of elasticity, density, thermal conductivity, etc.) that must be accurately specified by the analyst for any type of simulation.
Figure 1: Typical PCB Layout Geometry
So, what are some ways that we can model this type of geometry? I’ve outlined below some common approaches: Continue reading →
Engineers at every company are trying to innovate faster while holding down costs. Modeling and engineering simulations are the backbone of these efforts. Engineers may wish to run ANSYS Fluent simulations at scale, or many different permutations simultaneously, that may require more computing resources than are readily available. Hybrid HPC computing combines public and on-premise compute resources to offer organizations a flexible, cost-effective approach to meet these requirements. Continue reading →