On January 27, ANSYS released its biggest version ever, ANSYS 17.0. Although the ANSYS simulation platform is renowned for its comprehensive coverage of virtually every industry through its extensive range of simulation tools, this latest release is particularly suited for the healthcare industry, whether you are modeling structural, fluid or electromagnetic applications — not to mention those of you engaged with multiphysics modeling. Among the hundreds of new features coming with this release, it might be easy to miss those which are truly important for the medical device, pharmaceutical or clinical sectors. Let me highlight 3 new or enhanced capabilities.
1 – Get scanned geometries ready for analysis faster with ANSYS SpaceClaim 17.0
In ANSYS SpaceClaim 17.0, I must highlight two major enhancements.
- Skin Surface enhances SpaceClaim’s reverse engineering capabilities by giving designers a powerful tool for building surface geometry on organic shapes.
- Shrinkwrapping couples nicely with Skin Surface by smoothing over rough scans and further solidifying any faceted model. When designers use both tools together, they have a compelling solution for the medical device industry that simplifies any scan file, then reconstructs the faceted data itself or accompanying models, such as a leg brace, arteries, respiratory tree, etc.
2 – Improve the fidelity of your model using new fluid and structural capabilities
ANSYS Mechanical 17.0 introduces innovations that improve the speed at which you can attain results without sacrificing accuracy. It enables you to use sub-models on beams to get detailed stresses on catheters and wires without having to solve the entire model in 3-D. You can automatically read in variable material models from packages such as Mimics™ to have truly accurate models of bones based on scan data, or you can g export .stl files of deformed geometry with a single mouse click.
ANSYS Fluent introduces an electropotential model to solve problems such as blood glucose measurement by a test strip. Powerful overset mesh capabilities provide a promising approach for cases where creating or remeshing a single mesh around multiple distinct geometries is impractical.
3 – Customize Chips (SoC) for medical applications
As medical devices trend to smaller form factors with faster, low-power devices, designers need to simulate the entire system of package, board, antennas and integrated circuits (ICs), to optimize designs. Co-simulation of these components can help design teams achieve the power efficiency, reliability, and safety requested for today’s complex medical devices. The ANSYS Chip-Package-System tool in ANSYS 17.0 enables a complete workflow from early chip implementation to system-level optimization of chip, package/board, and system.
It is difficult to cover such a major release in a single blog post. Other new features and benefits built into ANSYS 17.0 enable you to:
4 – Simulate larger structural models faster
5 – Dramatically compress time-to-CFD solutions
6 – Bring CFD and multiphysics to every engineer with ANSYS AIM
7 – Take human variability into account with NEVA body models
8 – Model 3-D system assembly capabilities with ANSYS Electronics Desktop
9 – Get a 10X productivity for system verification
10 – Lower simulation entry barriers with ANSYS ACT customizability capabilities
To read about these 10 compelling reasons and more, see the the related technical paper, 10 Compelling Reasons for Upgrading to ANSYS 17.0 for Healthcare Applications.
To learn even more, sign up for our next Monthly Healthcare Webinar on April 13 and hear some of the top healthcare industry experts from ANSYS discuss the most important and relevant features of ANSYS 17.0.