Since ANSYS acquired Apache Design last year, our team has been developing a chip-package-system (CPS) design approach that provides engineers with enough knowledge and confidence to make optimal cost, performance and reliability decisions for their designs.

Our simulation-driven CPS methodologies make it possible to provide the entire electronics supply chain with a more robust and reliable design that has greater predictability. This simulation flow enables engineers to resolve many or their toughest design challenges. The solution provides fully coupled chip-aware, physics-aware simulations for the chip-package-system design. The best-in-class dynamic power extraction solution from Apache Design is now coupled to industry-standard physical extraction simulators from ANSYS, providing full electromagnetic extraction, signal and power integrity, and electromagnetic interference analysis, as well as thermal, mechanical stress and other solutions needed as 3-D integrated circuit technologies become mainstream.

There are several upcoming opportunities to learn more about this significant ANSYS chip-package-system design flow. First, we will host a webinar with EE Times entitled Chip Aware System Design on September 26 that will focus on methods to successfully design power delivery-networks with the chip to ensure system metrics are met in context of the system as a whole, rather than individual parts. (REGISTER)

Additionally, we will conduct a series of technical seminars that overview the ANSYS signal integrity/CPS, RF and antenna and low-power IC design software. At these events, we plan to introduce our latest electronics design technology and simulation breakthroughs that can help you to design next-generation electronics products. To get more information and register, visit www.ansys.com/dimensions.