Learn About the Many Innovative Features of ANSYS 18

I’m excited and honored to share with you the innovations in the latest release of our suite of simulation solutions, ANSYS 18, on behalf of over a thousand R&D professionals at ANSYS. The driving force for these innovations is the spread of simulation to all areas of engineering practice, a trend we call “pervasive engineering simulation.”

This trend is enabling engineers to explore the design parameter space earlier in the product lifecycle (digital exploration), test thousands of detailed designs rapidly and efficiently (digital prototyping), and monitor and optimize their product’s operation after it has been deployed (using digital twins).

To make pervasive engineering simulation as easy as possible for all engineers, we’ve added a lot of new features to each product family, as you can see below. For more information on ANSYS 18, including demo videos, webcasts, application briefs and technical papers, see our ANSYS 18 web pages.

Fluids

In the fluids suite, ANSYS 18 introduces ANSYS CFD Enterprise, a comprehensive product for engineers who need to solve the toughest and broadest range of fluid dynamics problems. It includes full versions of all ANSYS CFD solvers, plus special solutions for combustion, icing and material processing, as well as technology for geometry editing and clean-up, meshing, optimization and system simulation. This single product addresses the broadest array of fluid simulation applications with ANSYS’ gold standard accuracy. Check out this CFD Product Comparison chart to see the full breadth of this product.  The ANSYS fluids suite also offers new breakthrough harmonic analysis for accurate and reliable turbomachinery analysis 100 times faster than before, as well as meshing advancements that accelerate simulation for assemblies with moving parts.

Harmonic Analysis delivers the same accuracy as a full wheel solution
while speeding the simulation by up to 100x.

Structures

In the structures suite, ANSYS 18 has innovative tools and technologies to analyze complex materials, and to optimize designs and shapes for new manufacturing methodologies. New parallel topology optimization technology makes lightweighting of structures to meet design and performance needs easy. With our new spectral fatigue capability, you can accurately model and predict the structural integrity of electronic components. Using hierarchical submodeling, you can predict thermal stress and warping from the package and printed circuit board level, up to complete electronic systems using CAD and ECAD representations.

ansys 18 - Structural analysisANSYS Mechanical has new built-in topology optimization to easily determine where material can be removed for lightweighting of components.

Electromagnetics

The electromagnetics portfolio addresses the megatrends of mobile communications, energy efficiency and automation. ANSYS 18 delivers a faster, more robust design process that helps you to perform detailed electronics simulation earlier in the design cycle. The antenna and wireless design suite features a new streamlined workflow with an enhanced antenna design kit, broadband adaptive meshing and advanced computational capability to solve large-scale electromagnetic simulations for autonomous vehicle development and other advanced communication systems.

The chip-package-system workflow features a highly advanced 3-D layout assembly capability that supports multiple IC packages, printed circuit boards and connectors in a single environment. Engineers can now perform transient circuit-based simulation, system-level verification and comprehensive cooling analysis from a single design. With these enhancements, you can perform 3-D electromagnetic simulation as easily as basic circuit analysis, but with results that are orders of magnitude more accurate. Engineers in the industrial machinery and power electronics sectors can now analyze noise-vibration in electric motors and transformers, which is essential to developing quiet, efficient machines. The low-frequency solution also includes powerful new capability to simulate electromagnetic and thermal effects in planar magnetic components, critical for designing lower profile consumer electronics and power transformers.

ansys 18 electronics

ANSYS advanced 3-D layout assembly enables PCB, IC packages and connectors to be assembled in a single simulation.

Semiconductors

At the semiconductor level, ANSYS 18 helps you design chips based on the most advanced semiconductor process technology, and ensures the highest possible power integrity and reliability across chip, package and system. The semiconductor suite is certified by all leading foundries, including TSMC, for IR and EM signoff on its 7nm process node. You can also analyze advanced 3-D integrated circuit designs from TSMC for its InFO™ package technology. ANSYS 18’s comprehensive chip-package-system design workflow automates thermal and integrated structural analysis – enabling our customers to deliver reliable, smaller, higher-power density devices to market faster.

Embedded Software

ANSYS 18 extends our technology leadership in high-integrity embedded software solutions for avionics applications. With the ANSYS SCADE Architect avionics package in ANSYS 18, you can design systems that conform to the FACE™ technical standard and are AADL-compliant to fulfill DO-178C and ARINC 661 requirements. The SCADE family boasts tighter interoperability and advancements across the workflow, from architectural description to certified automatic code generation. ANSYS model-based software development solutions dramatically reduce the cost, risk and time to certification of embedded systems and software at the heart of aviation systems.

With the onset of autonomous driving, automotive applications are becoming more complex than ever, while demanding the highest level of safety and quality in the overall system. Advanced driver assistance systems (ADAS) make autonomous vehicles safe with advanced technologies that include radar, Light Detection and Ranging (LIDAR), vehicle communications, sensor fusion and deep learning. With the SCADE System automotive package in ANSYS 18, you can develop ADAS applications to test and certify complex, high-integrity embedded software applications that comply with the automotive open system architecture standard (AUTOSAR) as well as industry standards, such as ISO-26262 and Open GL SC 2.0.

ANSYS AIM

ANSYS AIM used to compute the steady-state temperature from eddy current heating in liquid glass.

ANSYS AIM is an easy-to-use, single-window application that combines guided workflows, accurate simulation solvers and optimization in a complete tool for performing simulation upfront in the product lifecycle.

AIM boasts intuitive CAD-to-results workflows and support for common structural, fluid, thermal, electromagnetic and injection molding simulation applications. In ANSYS 18, AIM has additional magnetic and thermal analysis capabilities for the design of electromagnetic devices such as transformers, converters and bus bars. Engineering teams will benefit from AIM’s expanded compatibility with ANSYS’ advanced mechanical and fluid simulation products — allowing users to start projects in AIM and transfer them for more advanced analyses. Also available in ANSYS 18 are full Chinese and Japanese language user interfaces, making AIM easier for engineers in those regions to perform upfront simulation.

Systems

In today’s complex products, individual components must reach high levels of performance and efficiency while also operating in concert with hundreds of other components in the system. Simulation has to be performed at both the component and system level to verify product requirements.

With system simulation in ANSYS 18, you can take advantage of breakthrough Reduced-Order Model technology to combine detailed 3-D component simulation results into system analysis. Through additional enhancements in the ANSYS Simplorer  system product line, including a graphical modeling environment for Modelica, expanded 0-D model libraries and extended support for the Functional Mock-up Interface (FMI 2.0), system engineers can combine physical sub-system models and embedded controls into complete system prototypes to verify real-world product performance.

ANSYS Simplorer is fully compliant with the Modelica Standard Library.

ANSYS App Store

As simulation becomes more pervasive in the product lifecycle, the ability to perform comprehensive multiphysics and system simulation on a single simulation platform further reduces development time and costs. With ANSYS 18’s new application builder, you can interactively create applications with minimum development effort, or take advantage of an array of simulation Apps available in the ANSYS App Store.

On the ANSYS App Store (appstore.ansys.com) there are a wide array of simulation apps from ANSYS’ ecosystem of partners and internal experts. Many are free of charge.

New process and data management capabilities of the ANSYS simulation platform have been extended to support metadata extraction of third party and in-house simulation tools. The ANSYS platform can be used with traditional paid-up, lease or new elastic licensing for on-premise installations. With elastic licensing, users can access any ANSYS product when they need it and pay for only what they use.

Believe it or not, that’s just a brief look at some of the enhancements available in ANSYS 18. We’re excited to offer you all these additional capabilities, and trust you will find them valuable. As you and your company seize the opportunities presented by new trends in manufacturing, communications, smart products and materials science, we’ll keep working on enhancing our software to ensure that you lead the world in product innovation through pervasive engineering simulation. More information is available on our ANSYS 18 web pages.

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  1. Pingback: ANSYS Spurs Pervasive Engineering Simulation With Release 18 - MONEY® News

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