ANSYS 18 Webinars You Don’t Want to Miss – Register Now!

ansys 18 webinarWith our recent release of ANSYS 18, our team has been working hard to bring you more in-depth information around the newest features and benefits you’ll find.

Here’s a list of the ANSYS 18 Innovation webinars, so that you can find your favorite topic(s) and easily register to attend right now!

For more event and in-person seminars, visit our Events Calendar.

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ANSYS 18 Innovations – Mechanical Products Update

February 14, 2017
9 AM EST / 2 PM GMT
4 PM EST / 9 PM GMT

Attend this webinar to learn how you can set up models more efficiently; model materials like reinforced concrete; and calculate fatigue in harmonic and random vibrations. Discover how to optimize topology to design efficient, lightweight parts, and how to incorporate data from external sources in your simulations.

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ANSYS 18 Innovations – Fluids

February 16, 2017
9 AM EST / 2 PM GMT
4 PM EST / 9 PM GMT

Attend this webinar to learn how serious CFD from ANSYS can help you solve your toughest fluid design challenges. Discover how Breakthrough Harmonic Analysis delivers accurate turbomachinery simulations up to 100x faster; how overset mesh can simplify and speed simulations that include structured mesh around individual parts; and how you can use ANSYS AIM for easy prep and meshing.

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ANSYS 18 Innovations – High Frequency Electromagnetics

FEBRUARY 21, 2017
11:00 AM – 12:00 PM (EST)

Attend this webinar to learn about the latest innovations in ANSYS HFSS 18.0, including a new streamlined antenna workflow with an enhanced antenna design kit, broadband adaptive meshing for improved accuracy and reliability, and the integration of our Delcross Savant technology into the new HFSS SBR+ (shooting and bouncing ray) workflow. Discover new productivity enhancements such as breakthrough HPC technology for faster and more memory-efficient frequency sweeps, and advances in 3-D component technology that provide a powerful collaborative platform for EM simulation.

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ANSYS 18 Innovations – Signal Integrity, Power Integrity, EMI

February 23, 2017
11:00 AM – 12:00 PM (EST)

Attend this webinar to learn how ANSYS 18.0 has enhanced the Chip-Package-System workflow to address design challenges in power integrity, signal integrity, ESD, thermal and structural challenges. Discover how ANSYS solutions provide a unique virtual prototyping flow to simulate the electrical, thermal, and mechanical behaviors of high-speed electronics, allowing you to meet your system power and performance targets while reducing cost.

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ANSYS 18 Innovations – ANSYS AIM

February 28, 2017
9 AM EST / 2 PM GMT
4 PM EST / 9 PM GMT

Join us for this webinar as we explore some of the major ANSYS 18.0 release highlights through live demonstrations. Topics will include:

  • Extended collaboration between designers and analysts
  • Simultaneous post-processing of multiple simulation results
  • Simulation of one-way fluid-structure interaction with structural shell elements
  • The use of expressions for capturing real-world conditions

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ANSYS 18 Innovations – Systems and Simplorer

March 2, 2017
9 AM EST / 2 PM GMT
4 PM EST / 9 PM GMT

With ANSYS 18, ANSYS Simplorer provides enhanced capability for modeling complete physical systems, with a new graphical modeling editor for Modelica, new Reduced-Order Model interfaces, and compatibility with model libraries from Modelon. Simplorer also extends its interoperability leadership, providing new and enhanced connectivity with systems engineering processes, support for FMI co-simulation, system model identification and closed-loop testing with embedded software designs in SCADE. Join us as Lee Johnson, Simplorer product manager, demonstrates these enhancements in this live webinar.

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ANSYS 18 Innovations – Embedded Software

March 7, 2017
9 AM EST / 2 PM GMT
4 PM EST / 9 PM GMT

  • How the automotive package provides you with a solution for developing ADAS applications
  • How enhancements to the avionics package deliver a solution for developing FACE applications that fulfill DO-178C requirements
  • How the combination of ANSYS SCADE Display certified and automatic code generation toolchain and OpenGL SC 2.0 enables you to address the unique and stringent certification requirements of safety-critical and high-reliability display system markets

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ANSYS 18 Innovations – ANSYS SpaceClaim

March 9, 2017
9 AM EST / 2 PM GMT
4 PM EST / 9 PM GMT

Join us for this webinar and learn about several improvements that are guaranteed to save time, enhance your designs and improve overall usability. We’ll cover:

  • Continued development of SpaceClaim’s scripting environment. With expanded recording capabilities and replayability of scripts on model versions, you’ll save time in the steps needed to automate geometry tasks.
  • Faceted data optimization and smoothing enhancements. You can greatly simplify and smooth topology optimized STL data for downstream printing, while preserving the integrity of localized regions.
  • Lattice Infilling for additive manufacturing. The Infilling functionality has greatly expanded to include several lattice infill types, all with custom options to ensure your 3-D printed component has an ideal strength-to-weight relationship.
  • Exploration of inner details of a model with the new fly-through capability. Without hiding components or using cross sections, this capability provides graphical feedback at your fingertips while making it even more enjoyable to work in a 3-D environment.

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ANSYS 18 Innovations – Low Frequency Electromagnetics

MARCH 14, 2017
11:00 AM – 12:00 PM (EDT)

Attend this webinar to learn about the latest enhancements to ANSYS Maxwell, including the industry-first Time Decomposition Method (TDM) for transient electromagnetic field simulation. With this patent-pending technology, you can solve all time steps simultaneously and distribute them across multiple cores, networked computers and compute clusters to greatly increase simulation capacity and speed. Discover Maxwell’s new automated setup for eccentricity, advanced anisotropy and vector hysteresis modeling, along with a new magnetostriction modeling capability that lets you link the electrical and mechanical performance of electric machines to ensure quiet, robust design.

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ANSYS 18 Innovations – Electronics Cooling

MARCH 16, 2017
11:00 AM – 12:00 PM (EDT)

Attend this webinar to learn about important new capabilities in ANSYS 18.0 regarding electronics cooling simulation, such as importing chip thermal models (CTM) from ANSYS RedHawk to ANSYS Icepak for thermal analysis of the complete IC, package and PCB. Designers of high-speed digital electronics, and thermal and mechanical engineers involved in electronic design should attend this informative webinar on electronics cooling analysis.

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