Before I tell you about this week’s events, DID YOU KNOW that you can view past recordings of ANSYS webinars in our Resource Library? In case you missed a specific topic you’re interested in, you can also filter your results by Industry or Product. Why not catch up on all the great content our experts have put together for ANSYS users today!
While you’re there, I’d like to invite you to browse and find other technical briefs, conference papers and case studies of interest to you. If there’s something specific you’re looking for, please leave a comment on this blog post and I’ll see what I can find for you.
ANSYS Webinars and other events this week.
Kicking off the week, you’ll find our experts in Tempe, Arizona. ANSYS is proud to be a sponsor of the EPEPS – the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems.
In Germany, you can attend the ANSYS Conference & the CADFEM Users’ Meeting. Users from industry, research and academia features more than 200 papers in up to 13 parallel sessions bridging the successful use of simulation technology in various industries and physical areas.
On Wednesday, in Los Angeles, California, join ANSYS and Apache as we introduce our latest electronics design technology and simulation breakthroughs that will help you to design next-generation electronics products. The challenges of electronics design are numerous, and many can be formidable: packing greater functionality into smaller portable devices while extending battery life, integrating multiple antennas into a single platform or developing 3D-IC architectures.
An if you can’t travel, why not attend the ANSYS webinar discussing “New Multiphysics Simulations Using ANSYS Icepak”. In order to meet the goal of increased device miniaturization, electronics companies are using various Electro thermal methodologies to optimize the design of electronics components. ANSYS Icepak provides streamlined interface for performing cross-physics simulations for electronic applications. ANSYS Icepak enables a true 360 degree analysis of electronic systems and provides flexibility to connect with other ANSYS tools such as SIwave, Simplorer, HFSS and Apache Sentinel TI. In this webinar, the focus will be on new capabilities of Ansys Icepak to connect with HFSS and Apache Sentinel-TI.
|Oct 21- 24||EPEPS||Tempe, Arizona, United States|
|Oct 24||Ask the Expert – New Multiphysics Simulations Using ANSYS Icepak||Online|
|Oct 24||ANSYS Seminar: Dimensions of Electronic Design||Los Angeles, California, United States|
|Oct 24 -26||ANSYS Conference & 30th CADFEM Users’ Meeting||Kassel, Germany|