Two years ago, ANSYS, Inc. acquired Apache Design to broaden its presence in the IC-aware system simulation market, particularly for the high-growth mobile and consumer electronics segments. We had a vision of combining chip-level analysis and modeling solutions from Apache with package and systems electromagnetics, thermal/fluids and mechanical simulation platforms from ANSYS, to enable the next generation of low-power, energy-efficient products. We had also underscored our commitment toward customers’ success by providing continuous support and technology innovation. On our two-year anniversary, we reflect on the progress that we have made toward this vision.
Since the acquisition by ANSYS, Apache has achieved:
- Eight consecutive quarters of meeting or exceeding performance targets
- 70% increase in license usage by our top 20 semiconductor customers
- Delivery on product roadmap for low-power sign-off, 16 nm- foundry certification, and emerging technologies such as FinFET and 3-D-IC
- In addition, ANSYS and Apache have collaborated on and delivered several chip–package–system cosimulation methodologies.
Within the ANSYS organization, Apache remains a subsidiary with its industry-specific sales and support channels. Apache’s customers continue to work directly with our technical team of domain experts. In a February 2013 audit, conducted by third-party firm Beacon, over 70% of those surveyed felt that the acquisition did not impact their support, and nearly 100% said that they will continue to invest in Apache’s products. Both ANSYS and Apache have identified and explored new market opportunities across various regions and industries.
Apache thrives by working closely with our customers and delivering innovative technologies that are often first in the market. Our team is highly motivated to help our customers achieve their increasingly stringent power-efficient design targets. All of our founders and our business and product leaders continue to work together to meet the accuracy and capacity challenges from Moore’s Law and expand key customer relationships. In fact, Apache’s team as a subsidiary has expanded by almost 20% since the acquisition.
Over the past two years, Apache has rolled out a number of new technologies, including RedHawk-3DX – the fourth-generation RedHawk SoC power analysis and sign-off platform re-architected to handle stacked-die (3-D-IC) designs. Recently, Apache’s tools were certified by TSMC for their 16 nm FinFET technology. In addition, the merging of ANSYS and Apache technologies has strengthened the connection between chip and system-level analyses, helping customers expand their simulation coverage for product integrity across an entire system. ANSYS 14.5 technology expands ANSYS’ CPS coverage by combining Apache’s IC solutions with ANSYS’ electromagnetics field simulation products to ensure that individual components work together as an integrated system.
Today, 19 of the top 20 semiconductor companies, 9 of the top 10 mobile IC organizations, and 9 of the top 10 automotive IC suppliers use Apache’s power sign-off solutions. Additionally, a strong channel synergy between ANSYS and Apache is helping us uncover multiple new opportunities and to grow our presence in several underserved markets and accounts.
All indications clearly show that we have achieved our initial goals with no disruption to customers, employees or product roadmap. We look forward to our continued growth as part of ANSYS and its unique position for providing leading simulation technologies for multi-scale and multiphysics complex system designs.