As digital electronic devices continue to shrink and put greater functionality within consumer and enterprise products, thermal management continues to grow as the bottle neck for defining next generation architectures. Significant challenges exist today because the heat being generated continues to rise while the thermal envelope remains constant for silicon devices.
While some switching power converters have moved to III-V semiconductor materials such as GaN, the overall system still contains many silicon semiconductor devices that must meet traditional thermal envelopes. The removal of this heat has become a critical aspect of the design process, often being a very significant driver of what can be delivered within an electronic product. Continue reading