About David Geb

David Geb is an Application Engineer at ANSYS, focusing on electronics thermal management applications with ANSYS Icepak. He has authored over 20 refereed publications in the area of heat transfer and thermal engineering. He received his Ph.D., M.S. and B.S. degrees in Mechanical Engineering from UCLA.

ANSYS 18 Innovations for Electronics Cooling

electronics cooling of mobile devicesAs digital electronic devices continue to shrink and put greater functionality within consumer and enterprise products, thermal management continues to grow as the bottle neck for defining next generation architectures. Significant challenges exist today because the heat being generated continues to rise while the thermal envelope remains constant for silicon devices.

While some switching power converters have moved to III-V semiconductor materials such as GaN, the overall system still contains many silicon semiconductor devices that must meet traditional thermal envelopes. The removal of this heat has become a critical aspect of the design process, often being a very significant driver of what can be delivered within an electronic product. Continue reading