TSMC’s InFO Packaging Technology is a Game Changer, empowered by ANSYS

For engineers designing integrated circuits (IC) including system on chips (SoC), using integration and miniaturization to increase performance and bandwidth while reducing power and footprint has been an ongoing, continuous strategy. Now TSMC has developed an InFO packaging technology that is truly a game changer!

Why is InFO technology a game changer?

As mobile phones and other handheld devices continue to be a key driver of semiconductor innovation, chips often go into systems that demand a small footprint and minimum height. Since wiring dimensions of a chip are much smaller than that on a board, a chip cannot be mounted directly on a board. Continue reading

You Can’t Use Simulation to Design Planar Magnetic Transformers!

Throughout my 25 years in the computer-aided engineering industry, some of the smartest people I know have told me that you can’t use simulation to design planar magnetic transformers. Is it true? No! What they’re really saying is that there isn’t an effective way to simulate the devices to predict the full behavior — which includes electromagnetic losses, harmonic content, EM-thermal coupling and ultimately how the electromagnetic fields and temperature affect the circuit — in a reasonable amount of time for simulation to be an effective design tool. Continue reading

Antenna Design Workflow with ANSYS 17.2

antenna-designAntennas are the lifeblood of connected, mobile and many emerging IoT products. Consumers expect a reliable connection every time; anything short can kill a product launch or, worse yet, tarnish a corporate brand. That’s the market reality. The engineering reality is that there are significant engineering challenges associated with designing antennas and radio systems, including providing reliable connectivity and maintaining reasonable performance within an ever shrinking design footprint. Many of today’s devices need to operate in an increasingly crowded radio spectrum with the possibility of co-site conditions, operation near the human body and other challenging installed environments. Continue reading

New Technology Radically Speeds the Simulation of Transient Electromagnetic Fields

Transient Electromagnetic SimulationElectric machines, power and electronic transformers and other devices can be better designed and analyzed using transient electromagnetic field simulation. This choice allows engineers to analyze the dynamic system including the non-linear materials, permanent magnets and induced eddy current under a variety of conditions, employing various excitations including the pulsed waveform. Continue reading

Wireless Power Transfer (WPT)

Wireless power transfer (WPT) is much researched and discussed in the context of IoT, electric vehicles and mobile electronic devices. The methodology of powering a device without a physical connection is well known. However, designing the coil shapes and their placement, maximizing efficiency and validating behavior at the system level still represent challenges that cannot be achieved without simulation. The next frontier to be explored is extending and applying wireless power transfer systems to more applications, such as continuous charging of multiple devices, increasing the range of efficient power transfer and ensuring the WPT system design meets regulatory guidelines. Continue reading

Internet of Things – Making Wireless Happen

internet of things wireless office antennaWireless communication is changing our world. The number and density of antennas in our immediate surroundings have exploded, and are increasing every day. There are literally hundreds of antennas in a typical home and thousands in an office building. Driven by the demands of the Internet of Things, along with autonomous vehicles and electrification initiatives in the aerospace sector, more antennas are required to be integrated into our devices to make all of this wireless interconnectivity possible. Continue reading

Speeding Innovation – Advancements in High Tech Simulation with ANSYS 17.0

It isn’t too much of a stretch to say that Moore’s Law can be credited with many of our technological advances. Since the 1960s, Gordon Moore’s prediction that computing performance will double every 12 to 18 months has been accepted as gospel. And the proof is all around us. The conveniences of the modern world — ubiquitous communication through Internet enabled phones, electronic payments, and digital streaming, to name just a few examples — are all due to continuous engineering innovations delivered through cheaper, faster, more precise electronics. Continue reading

10x Faster Transient Electromagnetic Field Simulation

“I feel the need. The need for speed!” is a famous line from the movie Top Gun. Designers of electric motors, power transformers, planar transformers, and actuators — or anyone that regularly runs transient electromagnetic field simulations — can relate to that phrase. Transient electromagnetic field simulation is a powerful, accurate method to solve EM problems in the time domain, but the process is painfully slow even with today’s fastest computers. Thus, EM transient simulations often are relegated to the verification stage rather than the design stage of the device. With ANSYS Maxwell in ANSYS 17.0, you can now channel your inner Tom Cruise — ANSYS delivers on your need for speed! Continue reading

Incredible High Frequency Design Accuracy with ANSYS HFSS and Modelithics Models

In the five short years that I have been in the RF and Microwave design industry, I have seen the demand (and need) for quick and accurate electronic design simulations escalate rapidly. I have also had the opportunity to interact with many design engineers during this time who have come to the same conclusion – they need more accuracy. Whereas ideal component simulation models or s-parameter files were once acceptable, this is much less often the case now. Parasitics have a considerable effect on component response, and even more so as design frequency increases. Labor and material costs multiply with each design iteration, so it is very important to limit these cycles and achieve a successful design early on. Continue reading

ANSYS Chip Package System Analysis Ready for the “Next Big Thing” in Mobile Design

Delivering a truly innovative product for the mobile revolution requires optimization at every level of design for power, performance, thermal and structural integrity. The success of today’s electronic products are tied to the success of their entire system, including all components from antenna to board, and from chip to chassis. Designing a smart watch, for example, requires multiple iterations of chip, package, board, antenna, and cooling strategy to arrive at a final optimized product. Continue reading