Here’s some exciting technology with a view into the future. Imagine that when your cell phone battery gets low you can charge it just by walking around. Nanotechnology has the ability to deliver that promise as described in a recent article on theENGINEER.
We’ve heard a lot about alternative energies in recent years like wind, solar, tidal, etc. This represents a new form based on harvesting mechanical energy from vibrations. The Journal of Nanomaterials features a research article that shows how ANSYS Mechanical is used to develop this new energy source by simulating the piezoelectric behavior of the nanogenerators. Continue reading
I’ve got a lot to say about Systems Engineering for Smart Products, so this is the first in a series of blogs. In nearly every industry, consumers are benefiting from the evolution of smart products. These are highly-engineered, multi-functional products that interact with people and their environments in new ways to ensure our safety, improve efficiency or reduce energy consumption. Under the hood of every smart product is a complex system (or a series of subsystems) of micro-electronics, embedded software and advanced sensor technology that have to operate in unison to measure operating conditions, predict future events, communicate with other devices, and respond to changes faster and more accurately.
Engineering these systems into a commercially viable product is far from trivial. Today’s smart products have thousands of unique requirements that need to be served by a multiplicity of subsystems and components. Each component may have hundreds of design parameters and multiple interfaces that need to be engineered, verified and validated. The endless design dimensions present opportunities for innovation, as well as for design failures, which may result in recalls, lost revenue and a tarnished corporate brand. Continue reading
Nearly every industry today deals with issues of an increasingly complex supply chain, representing interconnected relationships between OEMs, and their Tier 1, 2 and 3 suppliers. Customers who perform simulation driven product development are acutely aware of the supply chain issues, because simulation tools used by various companies are usually different and often not interoperable. This is where standards come in — modeling standards like the IEEE VHDL-AMS language provide a clear modifiable description of behavior and all tools that support this language are expected to behave the same way. However, since each tool provides its own implementation of the language compiler (typically converting from the standard modeling language to C++ code), there can be some differences in behavior. Continue reading
ANSYS had an exciting week at DesignCon 2014 in Santa Clara, California a couple of weeks ago. After MANY hours of demos, networking, panel discussions, award dinners and paper presentations, we are back in action and ready to take what we learned about the latest industry trends and challenges and see how we can apply it to ANSYS simulation.
At the show, we announced a new suite of electronic products designed to help users quickly identify potential power and signal integrity problems throughout the PCB design flow. Attendees of our in booth presentations on the new SIwave were excited to see the new targeted capabilities and design flows to address such critical issues as DC voltage drop analysis, power integrity and automated decoupling capacitor optimization and end-to-end signal integrity analysis design flow. Continue reading
2014 is forecast as a banner year for Internet of Things (IoT). The Internet of Things is simply taking electronic devices and connecting them to the Internet — and in many cases connecting them to each other. It was all the rage at the recent Consumer Electronics Show (CES) in Las Vegas, where a whole new generation of products were introduced from connected cars to connected toothbrushes. So how might this play out?
Gartner is forecasting that by 2020 there will be 26 billion smart devices and 7.3 billion smartphones. By 2050, analysts are projecting that there will be 50 billion Internet-connected devices, or five gadgets for every man, woman and child.
Meanwhile, Cisco is projecting a 66% CAGR (Compound Annual Growth Rate) in data traffic from 2012 to 2016. We will be transferring 7.4 extabytes of information each month over our mobile networks in 2016. (I looked up exabyte. It is 1018!) Continue reading
In 2009, the University of Wisconsin-Milwaukee, with full support from ANSYS, deployed an initiative to the region’s industrial community by launching the ANSYS Institute for Industrial Innovation (AI3). Recently, ANSYS and the university launched a video about common interests and partnership activities that tells the story behind the institute.
As you heard in the video, the institute at UWM is a portal for industry to engage with academia to foster economic growth and development of regional industries and educational institutions, leveraging world-class CAE capabilities including CAD, FEA and system simulation platforms. AI3′s framework provides an infrastructure that spans the product development cycle from concept to functional prototype. Continue reading
ANSYS offers a comprehensive set of tools to study battery systems at different scales, from system to pack to cell level. This work simulates battery physics and chemistry at the micro-scale, where the micron-sized electrode particles are resolved. Such simulations are useful to understand the effects particle morphology, as well as analyzing mechanisms that cause cell degradation and capacity-fade.
The project is a collaboration between ANSYS and Colorado School of Mines, funded by the Office of Naval Research (ONR). Actual battery electrode morphologies are obtained from Focused-Ion-Beam Scanning-Electron-Microscope (FIB-SEM) measurements. The FIB cuts a thin layer from the battery electrode, and the SEM images are stored as jpeg files. A surface mesh is made from the sequence of jpeg files using the Mimics software tool. A cut-cell volume mesh is created from the surface mesh using the ANSYS meshing tool. Continue reading
When I came from Microsoft to join ANSYS in April, I knew that ANSYS had been offering industry-leading engineering simulation software for more than four decades. But what I did not know was the amount of innovation and product technology that the company had lined up to deliver this year — and over the next several years. As a result of the work I’ve done with product development teams, I have grown even more passionate about ANSYS and what it has to offer the industry. I am, therefore, as proud as the rest of the team in announcing the release of our new product suite. ANSYS 15.0 builds upon the many years of leadership and includes dramatic upgrades in each of the key physics areas (electromagnetics, fluid dynamics, structures and embedded code). The combination of performance improvements, new solver capabilities, HPC scalability advances and pre-processing enhancements delivers insights into the most challenging product designs.
Because manmade materials are everywhere, ANSYS 15.0 provides structural analysts with advanced new functionality for simulating composites. What I find very exciting is the innovation built in to ensure efficiency throughout the entire modeling process. For example, users can apply submodeling techniques in the pre-processing workflow to create high-fidelity local results while employing a coarser model globally to reduce overall computation time. Continue reading