When I came from Microsoft to join ANSYS in April, I knew that ANSYS had been offering industry-leading engineering simulation software for more than four decades. But what I did not know was the amount of innovation and product technology that the company had lined up to deliver this year — and over the next several years. As a result of the work I’ve done with product development teams, I have grown even more passionate about ANSYS and what it has to offer the industry. I am, therefore, as proud as the rest of the team in announcing the release of our new product suite. ANSYS 15.0 builds upon the many years of leadership and includes dramatic upgrades in each of the key physics areas (electromagnetics, fluid dynamics, structures and embedded code). The combination of performance improvements, new solver capabilities, HPC scalability advances and pre-processing enhancements delivers insights into the most challenging product designs.
Because manmade materials are everywhere, ANSYS 15.0 provides structural analysts with advanced new functionality for simulating composites. What I find very exciting is the innovation built in to ensure efficiency throughout the entire modeling process. For example, users can apply submodeling techniques in the pre-processing workflow to create high-fidelity local results while employing a coarser model globally to reduce overall computation time. Continue reading
Electric motors consume nearly half of all global energy, so the drives need to be highly efficient. Electric machines include materials that can vary drastically in price over a relatively short period of time due to market demands and a limited supply of the raw materials. Traction motors used in hybrid electric vehicles (HEV/EV) utilize rare earth permanent magnets. Changing a design parameter, such as the shape or size of the magnets, most likely will have consequences on performance such as a reduction in efficiency or will introduce a change in torque quality.
The modified design and the original design provided by Magna Electronics. The modification included the reduction of the magnet length and decrease of “V-angle” of the magnets.
Engineers who design interior permanent magnet (IPM) machines most often create a 2-D plot of the efficiency and torque of the machine versus its rotation speed, known as an efficiency map. The goal is to reduce the magnet size and maintain the maximum torque and efficiency for the entire speed and torque range. An efficiency map can be created by taking measurements in the test environment of the output torque, input power and output power. Of course, this means that the traction motor first must be designed and manufactured.
Also, at this late stage of the design cycle, making design changes to improve performance is costly and takes another round of prototyping. Consequently, IPM traction motor engineers utilize simulation tools that quickly, yet very accurately, predict the performance of the traction motor and drive product development. Engineers who are responsible for the electromagnetic design of IPM electric motors usually employ the finite element method (FEM).
A good impedance match between an antenna and the rest of the RF electronics is essential to antenna system performance. A properly designed matching circuit (typically consisting of inductors, capacitors and transmission line segments) increases antenna efficiency and bandwidth. Moreover, the use of matching circuits speeds up the antenna design process because automated circuit synthesis tools can design the matching circuits in a matter of seconds. Furthermore, the effect of last-minute physical product design changes on antenna performance can be compensated just by changing some component values.
However, there are a few things to watch out for when designing matching circuits. First, if the antenna itself is not properly designed, the matching circuit cannot magically resolve all design challenges. While a matching circuit can increase the operation bandwidth of an antenna, it can only do it to a certain extent and, thus, a matching circuit cannot turn a very narrowband antenna into an efficient ultra-wideband radiator. Continue reading
One of the little-known calculations within ANSYS HFSS is called Analytic Derivatives.
Normally, if an engineer is interested in design sensitivity, they run several parametric simulations, and create regression curves for the various outputs. These variations are typically run at min/typ/max values of all the relevant parameters, and a full design exploration can consume valuable compute resources.
Enter the Derivatives calculation. By using an algorithm during the matrix solution in HFSS, the solver can perturb the fields within the solution space, and extract the variations of the S-parameters to these perturbations. Thus, the engineer is able to extract design sensitivity from ONE simulation as opposed to running extensive parametric sweeps. Continue reading
The ANSYS electronics business unit regularly takes the pulse of the electronics revolution — electronics innovation that has affected the way we communicate, work, learn and entertain. As ANSYS celebrates the five-year anniversary of the Ansoft acquisition, we’ve been reflecting on the powerful synergies created by the combined company along with how we foreshadow the innovative simulation technology still to come.
ANSYS high-performance electronics and electromechanical design software is driving some of the most remarkable innovations in all types of industries. Leaders in mobile and consumer electronics have adopted our high-frequency extraction tools for IC packaging, printed circuit boards (PCBs), connectors, cables, antennas and enclosures.
The aerospace and defense sector benefits greatly from all of the ANSYS HFSS innovations. We have witnessed tremendous adoption of our antenna integration and stealth technologies by the brightest organizations; they chose our solutions over competitors and custom in-house codes. ANSYS Maxwell is integral to the development of new magnetic snap covers, wireless power transfer and quick-charge connectors in mobile consumer electronics. In automotive, our hybrid-drive solution combining efficient motor design with drive system analysis has become the standard development environment for hybrid and electric vehicles. Continue reading
Two years ago, ANSYS, Inc. acquired Apache Design to broaden its presence in the IC-aware system simulation market, particularly for the high-growth mobile and consumer electronics segments. We had a vision of combining chip-level analysis and modeling solutions from Apache with package and systems electromagnetics, thermal/fluids and mechanical simulation platforms from ANSYS, to enable the next generation of low-power, energy-efficient products. We had also underscored our commitment toward customers’ success by providing continuous support and technology innovation. On our two-year anniversary, we reflect on the progress that we have made toward this vision.
Since the acquisition by ANSYS, Apache has achieved: Continue reading
Who doesn’t have power issues designing chips? Power management and power closure are primary concerns for system-on-chip (SoC) designs. So what is the best way to address these power challenges? By using simulation technologies from early in the IC design phase to accurately predict the chip’s power consumption and analyze its power delivery network integrity within the context of the full system.
To learn more, register to attend ANSYS subsidiary Apache’s technical webinar series for IC design, with presentations from leading semiconductor companies Nvidia, Freescale and GlobalFoundries. Featured at the most recent Design Automation Conference (DAC), these customers will share design challenges, power methodologies – and their results using Apache tools. Continue reading
If you’re part of the system on chip (SoC) design community, there’s a good chance that you’ll be attending the Design Automation Conference (DAC) in early June in Texas. If you plan to make the trip, you’ll want to learn about the latest technology from ANSYS subsidiary Apache Design, as well as how leading semiconductor companies leverage these capabilities. There’s even a “Test Your Power IQ” game, with prizes awarded for participants and winners alike!
Visit Apache at DAC booth 1346.
For those involved in designing SoCs for electronic systems such as smartphones, tablets, cloud servers, automobile infotainment, and a variety of consumer electronic products, you know that some of your greatest concerns are power management and power closure. SoC complexity involves higher levels of integration, combining digital and analog functions on a single chip, continuous demand for longer battery life and lower energy footprint while delivering greater performance, and the need to ensure reliable operations, along with meeting the optimal cost target. The best way to address these power challenges is to use simulation technologies from early in the design phase. Continue reading