Designing Cool, Wearable Electronics with ANSYS and Synapse

nike fuel band Hardly a day goes by when we don’t hear about the upcoming revolution in wearable devices or the Internet of Things (IoT). The $3.2B acquisition of Nest® by Google clearly got noticed by all of us. But, the Nest thermostat is just one example of connected devices that are poised to change our lives over the coming years. The Nike FuelBand® and Fitbit® have already been helping us shape up for some time. Continue reading

Circuit Simulation Now Included in ANSYS HFSS for More Efficient Electronic System Design

Today, we announced that our ANSYS HFSS users can reduce design time and cost, while optimizing complete electronic system performance, thanks to linear circuit simulation embedded within the latest version of this software.

Designer SIWaveAt a high level, a more streamlined simulation workflow enables engineers to focus on enhancing complete system reliability and signal quality as well as analyzing electromagnetic interference. New HFSS product options for radio frequency (RF) and signal integrity (SI) analyses are also available — making high-frequency (HF) and high-speed electronic device design even more comprehensive. Continue reading

The State of the Art for Electric Motor Design

Have you noticed that electric machines are everywhere these days? They are present in industrial equipment, cars, planes, household appliances, computers, mobile devices and more. The applications for both large and small motors are just exploding. Power transfer technologies in airplanes, such as the central hydraulic system and flight control actuation, are being replaced with electric motors. Electric and hybrid electric vehicles are powered by electric motors. When you put your phone on vibrate, the pulsation is created by an electric motor! The increased use of electric machines is driven by the global demand for more-automated and power-efficient products. The key is to find a better process to take an electric motor design from start to end. Continue reading

HFSS 3-D Layout and the Phi Mesher

ANSYS HFSS has been the mainstay, gold-standard electromagnetic simulation technology for many years. There are many key pieces to its reliable technology — such as hierarchical vector basis functions for robust solutions to Maxwell’s equations, two-dimensional port solving technology, the trans-finite element method for fast extraction of s-parameter models, state-of-the-art fast and scalable matrix solving technology, and its flexible and easy-to-use parametric interfaces.

Recently, we introduced significant breakthroughs, many in the high-performance computing (HPC) area of HFSS, such as: the domain decomposition method (DDM); HFSS-IE a 3-D method-of-moment solver that includes ACA fast-solving technology as well as a physical optics solver;and hybrid solving that combines DDM and HFSS-IE and provides the ability to rigorously solve large-scale complex electromagnetic problems with a combination of finite elements and method of moments. Continue reading

Nanotechnology – A View Into the Future

Here’s some exciting technology with a view into the future. Imagine that when your cell phone battery gets low you can charge it just by walking around. Nanotechnology has the ability to deliver that promise as described in a recent article on theENGINEER.

We’ve heard a lot about alternative energies in recent years like wind, solar, tidal, etc. This represents a new form based on harvesting mechanical energy from vibrations. The Journal of Nanomaterials features a research article that shows how ANSYS Mechanical is used to develop this new energy source by simulating the piezoelectric behavior of the nanogenerators. Continue reading

Systems Engineering for Smart Products

I’ve got a lot to say about Systems Engineering for Smart Products, so this is the first in a series of blogs. In nearly every industry, consumers are benefiting from the evolution of smart products. These are highly-engineered, multi-functional products that interact with people and their environments in new ways to ensure our safety, improve efficiency or reduce energy consumption. Under the hood of every smart product is a complex system (or a series of subsystems) of micro-electronics, embedded software and advanced sensor technology that have to operate in unison to measure operating conditions, predict future events, communicate with other devices, and respond to changes faster and more accurately.

Engineering these systems into a commercially viable product is far from trivial. Today’s smart products have thousands of unique requirements that need to be served by a multiplicity of subsystems and components. Each component may have hundreds of design parameters and multiple interfaces that need to be engineered, verified and validated. The endless design dimensions present opportunities for innovation, as well as for design failures, which may result in recalls, lost revenue and a tarnished corporate brand. Continue reading

A New Model Exchange Standard – The Functional Mockup Interface

Nearly every industry today deals with issues of an increasingly complex supply chain, representing interconnected relationships between OEMs, and their Tier 1, 2 and 3 suppliers. Customers who perform simulation driven product development are acutely aware of the supply chain issues, because simulation tools used by various companies are usually different and often not interoperable. This is where standards come in — modeling standards like the IEEE VHDL-AMS language provide a clear modifiable description of behavior and all tools that support this language are expected to behave the same way. However, since each tool provides its own implementation of the language compiler (typically converting from the standard modeling language to C++ code), there can be some differences in behavior. Continue reading

ANSYS at DesignCon 2014 – Electronics Simulation Conference

ANSYS had an exciting week at DesignCon 2014 in Santa Clara, California a couple of weeks ago. After MANY hours of demos, networking, panel discussions, award dinners and paper presentations, we are back in action and ready to take what we learned about the latest industry trends and challenges and see how we can apply it to ANSYS simulation.

At the show, we announced a new suite of electronic products designed to help users quickly identify potential power and signal integrity problems throughout the PCB design flow. Attendees of our in booth presentations on the new SIwave were excited to see the new targeted capabilities and design flows to address such critical issues as DC voltage drop analysis, power integrity and automated decoupling capacitor optimization and end-to-end signal integrity analysis design flow. Continue reading