Dragonfly: The Mysterious Insect Driving Engineering Innovation

Who hasn’t dreamt of flying like a bird? From Leonardo da Vinci’s drawings of flying machines to Otto Lilienthal’s gliders, inventors have focused, quite logically, on human transport. We now take flying on airplanes for granted. But mechanical flight on a smaller, insect-level scale is less well-known. Micro-air vehicles (MAVs) have gained popularity in recent years due to wide range of small-scale applications in areas such as military, transportation, electronics, security systems, search and rescue missions, video recordings and many more. Successful prototypes depend upon valid, yet imaginative, designs as a starting point.  Continue reading

Multiphysics Simulation of a Car Side Mirror with ANSYS AIM

One of the most important problems in the automotive industry is the general multiphysics simulation of coupled phenomena, where multiple — and sometimes conflicting — conditions need to be accounted for, all at the same time. One common application is the resistive heating of a car side mirror.

Designing the mechanism for keeping the mirror defrosted must also take into account the structural response of the mirror as the external environmental conditions, such as air pressure and cold temperature, cause physical stress and thermal deformation. The task is a base requirement of the automotive industry and requires a full multiphysics approach, which is still a challenge for common finite element method (FEM) simulation. In this post, we’ll show you how our engineers at SVS FEM used ANSYS AIM to model a side mirror and multiphysics analysis to solve some of its difficult design problems. Continue reading

Design Subsea ROV Faster and Better with ANSYS CFD

The ROV, or subsea remotely-operated vehicle, is frequently used in marine operations such as underwater mapping, pipeline inspection and surveillance, sending payload, maintenance and operations on subsea oil and gas equipment such as BOP (blowout preventer) and Christmas tree assembly, which controls the oil/gas/water flow out of the well.

Underwater environments create various challenges for the manufacturers of the vehicle robotics. In addition to structure integrity under high pressure, complex underwater hydrodynamics characteristics due to coupling of motions in 6 degrees of freedom needs to be considered. Continue reading

Smart Home Technology and Simulation Solutions

smart home technologyThe concept of the “automated home and smart home” was first introduced over 80 years ago, and has been facing different technical limitations since then.

Recently, service providers and home appliance manufacturers have launched a new initiative to bring the concept of smart homes to reality allowing subscribers to remotely manage and monitor different home devices from anywhere via smart phones or over the web with no physical distance limitations. Continue reading

Defining the Future of Cloud-based Engineering Simulation: ANSYS at AWS re:Invent 2016

Each year the cloud faithful converge on Las Vegas in the fall for AWS re:Invent. This year’s event delivered exciting announcements for ANSYS users interested in performing engineering simulation on the AWS cloud.

With well over 30,000 attendees, the 2016 conference was too big to be contained within the expansive Venetian hotel/Sands expo complex and it spilled across into adjacent facilities (comfortable shoes were a requirement). Wednesday’s keynote session by Andy Jassy, CEO and Thursday’s session by Werner Vogels, CTO highlighted the growing reach of AWS. The conference featured a staggering number of new features, services and some powerful new hardware. Continue reading

Submodeling: Simple Solutions for Large-Scale Problems

If you’re an engineer who has dealt with large simulation models, you know there’s often a trade-off between accuracy and solution time. Submodeling is a technique you can use to reduce solution time without sacrificing accuracy of results.

A common strategy you can use to look at the overall behavior of an assembly or complex part of a large model is to simplify the model during preparation by removing small details, like fillets and holes. Simplifying models in this way can have a significant impact on run times. This simplification, while not excessively affecting overall model stiffness, may result in lower resolution of localized stresses. What you need, then, is a mechanism that allows you to “zoom in” on these details to examine behavior around specific areas.

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Importing ECAD Trace Data for Better Thermal and Vibrational Analysis

Many of our customers are reaping the benefits of the trace import functionality in ANSYS Mechanical, which accounts for the effects of copper distribution on every layer of a printed circuit board (PCB) — or printed circuit board assembled (PBA) — for your thermal stress analysis, modal, shock and random vibration simulations. Just think — you can capture the accuracy necessary to confidently make engineering decisions in a fraction of the time you are currently spending on lumped parameter models. In this post, I’ll give you a brief overview and explanation of the process. Continue reading

Systems Simulation Advances With ANSYS’ Acquisition of Medini

We’ve discussed the need to simulate a full system quite a bit in this blog over the years. The need is clear: as products become smarter and more complex, component or sub-system simulation alone isn’t sufficient. As automobiles become computers on wheels, as your mobile phone has more compute power than the desktops of only a few years ago, there are new ways for products to fail. In other words, systems safety and reliability analysis is more critical than ever. Continue reading

TSMC’s InFO Packaging Technology is a Game Changer, empowered by ANSYS

For engineers designing integrated circuits (IC) including system on chips (SoC), using integration and miniaturization to increase performance and bandwidth while reducing power and footprint has been an ongoing, continuous strategy. Now TSMC has developed an InFO packaging technology that is truly a game changer!

Why is InFO technology a game changer?

As mobile phones and other handheld devices continue to be a key driver of semiconductor innovation, chips often go into systems that demand a small footprint and minimum height. Since wiring dimensions of a chip are much smaller than that on a board, a chip cannot be mounted directly on a board. Continue reading

Billet Designs Uses ANSYS SpaceClaim as Primary 3-D CAD Tool

Billet Designs is a small engineering firm that found great success in using ANSYS SpaceClaim as their primary 3-D CAD tool. They specialize in wide variety of offerings for their clients, including product design for automotive and consumer products, programming, automation, PLC controls and robotics.

Steven Aguirre of Billet Designs says their main focus is on the design of electromechanical components of consumer products. His broad background in various industries gives him a unique and expansive knowledge into common design and product development issues and challenges. As the owner of a small engineering firm, he has to balance product design with marketing, order fulfillment, sales, manufacturing and general development of his product line. Continue reading