Recently, service providers and home appliance manufacturers have launched a new initiative to bring the concept of smart homes to reality allowing subscribers to remotely manage and monitor different home devices from anywhere via smart phones or over the web with no physical distance limitations. Continue reading
Many of our customers are reaping the benefits of the trace import functionality in ANSYS Mechanical, which accounts for the effects of copper distribution on every layer of a printed circuit board (PCB) — or printed circuit board assembled (PBA) — for your thermal stress analysis, modal, shock and random vibration simulations. Just think — you can capture the accuracy necessary to confidently make engineering decisions in a fraction of the time you are currently spending on lumped parameter models. In this post, I’ll give you a brief overview and explanation of the process. Continue reading
For engineers designing integrated circuits (IC) including system on chips (SoC), using integration and miniaturization to increase performance and bandwidth while reducing power and footprint has been an ongoing, continuous strategy. Now TSMC has developed an InFO packaging technology that is truly a game changer!
Why is InFO technology a game changer?
As mobile phones and other handheld devices continue to be a key driver of semiconductor innovation, chips often go into systems that demand a small footprint and minimum height. Since wiring dimensions of a chip are much smaller than that on a board, a chip cannot be mounted directly on a board. Continue reading
Throughout my 25 years in the computer-aided engineering industry, some of the smartest people I know have told me that you can’t use simulation to design planar magnetic transformers. Is it true? No! What they’re really saying is that there isn’t an effective way to simulate the devices to predict the full behavior — which includes electromagnetic losses, harmonic content, EM-thermal coupling and ultimately how the electromagnetic fields and temperature affect the circuit — in a reasonable amount of time for simulation to be an effective design tool. Continue reading
Antennas are the lifeblood of connected, mobile and many emerging IoT products. Consumers expect a reliable connection every time; anything short can kill a product launch or, worse yet, tarnish a corporate brand. That’s the market reality. The engineering reality is that there are significant engineering challenges associated with designing antennas and radio systems, including providing reliable connectivity and maintaining reasonable performance within an ever shrinking design footprint. Many of today’s devices need to operate in an increasingly crowded radio spectrum with the possibility of co-site conditions, operation near the human body and other challenging installed environments. Continue reading
Electric machines, power and electronic transformers and other devices can be better designed and analyzed using transient electromagnetic field simulation. This choice allows engineers to analyze the dynamic system including the non-linear materials, permanent magnets and induced eddy current under a variety of conditions, employing various excitations including the pulsed waveform. Continue reading
Wireless power transfer (WPT) is much researched and discussed in the context of IoT, electric vehicles and mobile electronic devices. The methodology of powering a device without a physical connection is well known. However, designing the coil shapes and their placement, maximizing efficiency and validating behavior at the system level still represent challenges that cannot be achieved without simulation. The next frontier to be explored is extending and applying wireless power transfer systems to more applications, such as continuous charging of multiple devices, increasing the range of efficient power transfer and ensuring the WPT system design meets regulatory guidelines. Continue reading
Wireless communication is changing our world. The number and density of antennas in our immediate surroundings have exploded, and are increasing every day. There are literally hundreds of antennas in a typical home and thousands in an office building. Driven by the demands of the Internet of Things, along with autonomous vehicles and electrification initiatives in the aerospace sector, more antennas are required to be integrated into our devices to make all of this wireless interconnectivity possible. Continue reading
It isn’t too much of a stretch to say that Moore’s Law can be credited with many of our technological advances. Since the 1960s, Gordon Moore’s prediction that computing performance will double every 12 to 18 months has been accepted as gospel. And the proof is all around us. The conveniences of the modern world — ubiquitous communication through Internet enabled phones, electronic payments, and digital streaming, to name just a few examples — are all due to continuous engineering innovations delivered through cheaper, faster, more precise electronics. Continue reading
“I feel the need. The need for speed!” is a famous line from the movie Top Gun. Designers of electric motors, power transformers, planar transformers, and actuators — or anyone that regularly runs transient electromagnetic field simulations — can relate to that phrase. Transient electromagnetic field simulation is a powerful, accurate method to solve EM problems in the time domain, but the process is painfully slow even with today’s fastest computers. Thus, EM transient simulations often are relegated to the verification stage rather than the design stage of the device. With ANSYS Maxwell in ANSYS 17.0, you can now channel your inner Tom Cruise — ANSYS delivers on your need for speed! Continue reading