If you’re an engineer who has dealt with large simulation models, you know there’s often a trade-off between accuracy and solution time. Submodeling is a technique you can use to reduce solution time without sacrificing accuracy of results.
A common strategy you can use to look at the overall behavior of an assembly or complex part of a large model is to simplify the model during preparation by removing small details, like fillets and holes. Simplifying models in this way can have a significant impact on run times. This simplification, while not excessively affecting overall model stiffness, may result in lower resolution of localized stresses. What you need, then, is a mechanism that allows you to “zoom in” on these details to examine behavior around specific areas.
Many of our customers are reaping the benefits of the trace import functionality in ANSYS Mechanical, which accounts for the effects of copper distribution on every layer of a printed circuit board (PCB) — or printed circuit board assembled (PBA) — for your thermal stress analysis, modal, shock and random vibration simulations. Just think — you can capture the accuracy necessary to confidently make engineering decisions in a fraction of the time you are currently spending on lumped parameter models. In this post, I’ll give you a brief overview and explanation of the process. Continue reading
We’ve discussed the need to simulate a full system quite a bit in this blog over the years. The need is clear: as products become smarter and more complex, component or sub-system simulation alone isn’t sufficient. As automobiles become computers on wheels, as your mobile phone has more compute power than the desktops of only a few years ago, there are new ways for products to fail. In other words, systems safety and reliability analysis is more critical than ever. Continue reading
For engineers designing integrated circuits (IC) including system on chips (SoC), using integration and miniaturization to increase performance and bandwidth while reducing power and footprint has been an ongoing, continuous strategy. Now TSMC has developed an InFO packaging technology that is truly a game changer!
Why is InFO technology a game changer?
As mobile phones and other handheld devices continue to be a key driver of semiconductor innovation, chips often go into systems that demand a small footprint and minimum height. Since wiring dimensions of a chip are much smaller than that on a board, a chip cannot be mounted directly on a board. Continue reading
Billet Designs is a small engineering firm that found great success in using ANSYS SpaceClaim as their primary 3-D CAD tool. They specialize in wide variety of offerings for their clients, including product design for automotive and consumer products, programming, automation, PLC controls and robotics.
Steven Aguirre of Billet Designs says their main focus is on the design of electromechanical components of consumer products. His broad background in various industries gives him a unique and expansive knowledge into common design and product development issues and challenges. As the owner of a small engineering firm, he has to balance product design with marketing, order fulfillment, sales, manufacturing and general development of his product line. Continue reading
I was fortunate enough to own a Lotus Elise for a number of years. I loved that car but had to give it up when I moved to the U.S. One of the reasons I liked it so much was the design philosophy it followed: “performance through lightweight.” The reduced mass of the car meant the relatively small engine could shove it along at a fair old rate, which is pretty obvious. But it also meant that the suspension didn’t have to be as beefy, and the amount of work the brakes had to do was also significantly reduced. Lightweighting has big benefits.
It’s a very virtuous cycle. Removing weight has a compound impact on pretty much all aspects of the car. Probably one of the least mentioned benefits (considering that this was a sports car) was the fuel economy. When I was driving at a steady speed on the motorway I could easily get better economy than a family sized diesel car. Continue reading
A few weeks ago, I had the honor and privilege of being one of a few invited attendees at the DOE Mission Innovation Workshop on Grid Modernization. The workshop was hosted by the University of Pittsburgh and held at the Energy Innovation Center. Attendees included leaders from the Department of Energy, Pittsburgh city government officials, community and foundation organizations, and representatives from key local industries — including major utilities, electrical system integrators, electrical system manufacturers and technology companies (like ANSYS).
Pittsburgh, and other similar cities, face significant energy and sustainability challenges over the next few years. These challenges stem primarily from the significant disparity in the goals that have been set — as can be seen in the SmartPGH video — and the current state of the grid and industrial equipment. Continue reading
According to Gartner, designing, testing and manufacturing 7nm FinFET-based system on a chip (SoC) requires massive resources: as much as $270 million and 500 man-years to bring the chip to market. Encapsulating such chips within a 2.5/3D package such as InFO-WLP improves power, performance and form factor while increasing the cost of design. To make a profit on that level of investment, the market for these chips tend to be high-end mobile and enterprise applications. To satisfy customer needs in these demanding markets, design teams have to deliver highly integrated devices that operate seamlessly and reliably for long periods of time. Additionally, you have to reduce the engineering time and cost, and ensure “first-time” working silicon. To do this you will need to move away from the traditional silo-based design flow to a chip-package-board co-simulation workflow and methodology. Continue reading
I would like to tell you about a new weekly webinar series we’re launching called ANSYS in ACTION. Before I do, let me ask you a few questions.
Do you like to see software in action before trying it yourself? Are you curious about how ANSYS software can be used to solve your common applications? Are you willing to take a 20 minute hot beverage break once a week to learn something new?
If you answered yes to these questions, the ANSYS in ACTION webinar series is for you. Beginning October 13th, at 1 pm EDT, application engineers from ANSYS will spend 20 minutes each Thursday showing you how ANSYS software can solve common problems. We are selecting applications that a large number of engineers face and showing them our best and easiest to use simulation solution, the solution that will produce the results they need to make good decisions fastest, for each one. Continue reading
A number of new and exciting workflow enhancements were included in ANSYS SCADE 17.2 for those who are validating and testing embedded software. In this blog, I’ll cover the top 3 enhancements.
Virtual System Testing Using Simplorer Entry
In ANSYS 17.2, all SCADE Suite users can immediately simulate and analyze virtual system prototypes thanks to the bundling of Simplorer Entry.
One of the main objectives of embedded software users is to perform closed-loop testing to tune the software application — as early as possible. As a best practice, embedding the application within a virtual environment is a great way to reduce testing costs. It can be performed first with simplified model of the environment using Modelica language then moved to high-fidelity models. Continue reading