European Microwave Week 2017 is almost upon us. The 6-day event provides access to the very latest products, research and initiatives in the microwave sector. It also offers attendees the opportunity for face-to-face interaction with those driving the future of microwave technology. Our ANSYS experts have been attending this conference for a number of years, and I’m proud to say we’ll be there again this year.
From October 10-12, you can stop by our Stand 103 to get the most up-to-date information on our solutions for RF, microwave and communications systems. I’m personally honored to be presenting two papers this year that I hope you’ll attend.
RF Power Amplifier Design Using Nested Multi-technology
Tuesday, October 10 – 11 am Stand 97
RF power amplifiers (PA) are a part of every wireless system. Wireless systems are achieving higher data rates by adopting more complicated modulation schemes; this requirement demands that the PA be designed with improved linear power and efficiency. On top of these additional design challenges, regulations are imposing tough specifications for Electromagnetic Interference (EMI).
To achieve these design challenges and reduce time to market, accurate simulation methodologies must be employed in the PA design process. Power amplifiers are composed of high-power RF transistors that integrate different material technologies into a single device that are mounted on a test fixture comprised of various materials.
Running circuit simulation with analytical models, including high power RF transistors, is no longer sufficient. Interaction between the different material technologies needs to be simulated to accurately predict the power amplifier performance. Utilizing the nested multi-technology capabilities of ANSYS software tools to enhance the power amplifier design process will be discussed in this presentation. In addition to the electro-magnetic simulations of the nested multi-technology for the power amplifier design, integration of thermal and mechanical simulations will be explored.
Modeling Delay Spread in Antenna-Environment-Antenna Coupling Scenarios
Thursday, October 12 – 12:30 pm Stand 97
The delay spread of signals in communications systems is a major cause of lost signals, reduced transmission rates, and elevated error rates for wireless communication and data links. Wireless and communication signals are transmitted by a source antenna to the receive antenna, natural environmental phenomenon such as multipath reflection and refraction cause the signal to arrive at the receiver with varying delays, distorting the signal content that must be processed by the receiver. However, if the receiver can be made to understand the environment before the signal with content is transmitted, it is possible to reconstruct the signal at the receiver by reversing the time delay spread effects.
Electromagnetic (EM) modeling and simulation poses the potential to model the EM environment between an antenna pair for a wireless link. However, most of these environments are electrically very large at the frequencies at which they operate, and may encompass a room, an entire building, or many city blocks.
In this presentation, we present a modeling and simulation approach to determining RF signal delay spread between antennas that includes a rigorous solution of the environment. An asymptotic high frequency electromagnetic analysis which utilizes the Shooting and Bouncing Ray (SBR) approach based on the Physical Optics (PO) framework will be used to demonstrate the prediction of signal delay spread, and also to visualize the propagation of signals through the environment in order to understand the causes for delay spread.
In conclusion, don’t miss the opportunity to meet with all of our expert at our Stand 103 to learn more about ANSYS Electromagnetics. I hope to see you there!