Happy Monday everyone! Here’s our list of ANSYS webinars this week. We’re pretty excited to be launching the NEW ANSYS in ACTION series this week as well. If you haven’t heard of it, or checked it out yet, I encourage you to do so. There are a lot of great topics coming up that I think you’ll like.
And now, here’s what’s up this week. Continue reading
RIT Clean Snowmobile Team SAE (Society of Automotive Engineers) is a student organized team that is designing, building, and racing a low emissions and high efficiency snowmobile in the SAE Clean Snowmobile Challenge. The Clean Snowmobile Challenge (CSC) is an engineering design competition for college and university students that challenges future engineers to redesign an existing snowmobile for reducing emissions and noise. The intent of the competition is to develop a snowmobile that is acceptable for use in environmentally sensitive areas, such as our National Parks and other pristine regions. Continue reading
A few weeks ago, I had the honor and privilege of being one of a few invited attendees at the DOE Mission Innovation Workshop on Grid Modernization. The workshop was hosted by the University of Pittsburgh and held at the Energy Innovation Center. Attendees included leaders from the Department of Energy, Pittsburgh city government officials, community and foundation organizations, and representatives from key local industries — including major utilities, electrical system integrators, electrical system manufacturers and technology companies (like ANSYS).
Pittsburgh, and other similar cities, face significant energy and sustainability challenges over the next few years. These challenges stem primarily from the significant disparity in the goals that have been set — as can be seen in the SmartPGH video — and the current state of the grid and industrial equipment. Continue reading
According to Gartner, designing, testing and manufacturing 7nm FinFET-based system on a chip (SoC) requires massive resources: as much as $270 million and 500 man-years to bring the chip to market. Encapsulating such chips within a 2.5/3D package such as InFO-WLP improves power, performance and form factor while increasing the cost of design. To make a profit on that level of investment, the market for these chips tend to be high-end mobile and enterprise applications. To satisfy customer needs in these demanding markets, design teams have to deliver highly integrated devices that operate seamlessly and reliably for long periods of time. Additionally, you have to reduce the engineering time and cost, and ensure “first-time” working silicon. To do this you will need to move away from the traditional silo-based design flow to a chip-package-board co-simulation workflow and methodology. Continue reading
The Gartner Hype Cycle charts are a peek into the future. They graphically project where various technology trends are along a maturity timeline. The most recent Hype Cycle identifies several megatrends, including digital business technologies and new design and innovation approaches, such as IoT product design.
Happy Monday everyone! Sorry I’m getting a late start on blogging today. We’ve got some great ANSYS webinars lined up this week. Make sure you register today!
For more information about ANSYS webinars and trade shows we’re at, please visit our ANSYS Events page. Continue reading
Do you want to work for the global leader in engineering simulation? Take a look at our latest open ANSYS jobs. At ANSYS, you will be working with nearly 3,000 other professionals in more than 75 locations around the world. You too can make a difference in product development. If there isn’t something in this listing, take a look at our careers page. All of our current openings are listed there. Remember, we only take applications via our on-line site. Continue reading
Sitting in my office in the innovation capital of India, Bangalore, I read an article that the city alone is home to 65% of Indian startups. India is home to the largest number of startups next to the U.S., UK and China. While India boasts of several billion-dollar ‘unicorns’ in the app and software arena, there are also hardware startups that are making their presence count. For example, Lechal is making haptic footwear for the visually blind, Grey Orange Robotics indigenously developing robotics solutions for e-commerce warehouses and Ezetap converting smartphones into mobile point of sale solutions are just a few hardware companies that are pushing the envelope.
It is estimated that India’s 4200 startups, which includes over 30 hardware startups and over 35 startups in the IoT space, created 80K new jobs by the end of 2015. Over the next four years, the number of Indian startups is expected to rise to 11,500, employing 250k people. Continue reading
I would like to tell you about a new weekly webinar series we’re launching called ANSYS in ACTION. Before I do, let me ask you a few questions.
Do you like to see software in action before trying it yourself? Are you curious about how ANSYS software can be used to solve your common applications? Are you willing to take a 20 minute hot beverage break once a week to learn something new?
If you answered yes to these questions, the ANSYS in ACTION webinar series is for you. Beginning October 13th, at 1 pm EDT, application engineers from ANSYS will spend 20 minutes each Thursday showing you how ANSYS software can solve common problems. We are selecting applications that a large number of engineers face and showing them our best and easiest to use simulation solution, the solution that will produce the results they need to make good decisions fastest, for each one. Continue reading
A number of new and exciting workflow enhancements were included in ANSYS SCADE 17.2 for those who are validating and testing embedded software. In this blog, I’ll cover the top 3 enhancements.
Virtual System Testing Using Simplorer Entry
In ANSYS 17.2, all SCADE Suite users can immediately simulate and analyze virtual system prototypes thanks to the bundling of Simplorer Entry.
One of the main objectives of embedded software users is to perform closed-loop testing to tune the software application — as early as possible. As a best practice, embedding the application within a virtual environment is a great way to reduce testing costs. It can be performed first with simplified model of the environment using Modelica language then moved to high-fidelity models. Continue reading