Engineering Wearable Technology for the Internet of Things

image of wearable technology internet of thingsThere are already 1.9 billion devices connected to the internet — from home thermostats to fitness bands and refrigerators — with that number slated to reach over 9 billion by 2018. In terms of dollars, according to the latest forecast from IDC, the Internet of Things (IoT) market will grow to more than $7 trillion, up from $2 trillion today with wearable technology leading the way. Continue reading

Coupled Diffusion Analysis in ANSYS Mechanical

Diffusion is the process by which subject is transported from one part of a system to another as a result of random molecular motions, which is analogues to transfer of heat by conduction. Examples of diffusion are, but not limited to, spreading of odors and smoke (in gas), dissolution of colored dye in water (in liquid), formation of alloys, solid-state reactions, formation of new grains in cold-worked metal, improving surface wear by carburizing, gas purification, impurity doping of silicon wafers for integrated circuits. Continue reading

Stay CAD Connected

image of CAD parameters geometryRecently my colleague, Simon Pereira, published his blog on the use of parameters with PTC’s Creo CAD system.  I don’t think we can stress enough the importance of the connection between your CAD system and your simulation tool, be it FEA, CFD or electronics.

All simulations start from a geometry. The geometry can be a very early version of a given design or a manufacturing-ready version of it. You then need to import it into your simulation tool to analyze it. Continue reading

This Week’s Top 5 Engineering Technology Articles

Hello all! My top engineering technology picks of the week includes a smart bench that charges your devices, a floating village in London and a robot producing “wall art.” Have a great weekend!

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ANSYS Webinars Available in August

ansys webinars what you need to knowWe can never stress the importance of learning too much. It’s the thing that helps all of us propel our careers forward and get our jobs done more effectively. Here’s a list of our ANSYS webinars coming up in August for you to attend for free.

The only requirement is that you register to attend. Hope to see you there! Continue reading

Using CHEMKIN Simulation Software for Complex Chemical Processes

As a new member of the ANSYS family, via the Reaction Design acquisition, I thought I would take the opportunity to give you a little background on the product line I represent — CHEMKIN.

The software had its beginnings at Sandia National Laboratories, as part of the U.S. Government’s response to the oil crisis of the 1970s. Scientists at Sandia began studying how to make more efficient, cleaner-burning engines, and they created software to simulate the complex molecular-level chemical reactions that take place during fuel combustion. In 1997, Reaction Design licensed that software from Sandia and evolved the technology into a commercial-quality software suite that enables engineers and scientists in microelectronics, combustion and chemical processing industries to develop a comprehensive understanding of chemical processes and kinetics. Continue reading

This Week’s Top 5 Engineering Technology Articles

This week’s Top 5 engineering technology articles feature some devices to protect us from disease, car accidents and sweat as well as a few technology advances for some popular gadgets and toys. Trust me; you won’t want to miss the article on LEGOs.

Spacesuit Technology Is Making Its Way Into High-End Dress Shirts So Men Sweat Less
The Blood Harvest
Watch LG Roll Up An 18-Inch OLED Panel While It Plays Video
Sensor-Powered Seatbelt Could Save The Lives Of Sleepy Drivers
This Fully Functional Microscope Is Built Entirely Out Of Lego
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How Is FinFET Technology Changing the Meaning of Chip Sign-Off?

Physical Representation FinFET TechnologyModern high-tech products using chips that are designed with the latest deep sub-micron process technologies (28nm and below) and FinFET technology offer higher performance, smaller footprint and lower power. However, power integrity analysis and reliability challenges become increasingly complex for chip package designs using these devices.

More stringent manufacturing rules present basic layout challenges and new design innovations require careful consideration of effects such as electromigration (EM), electrostatic discharge (ESD) and noise coupling through substrate, signal and power rails. Even the most thorough sign-off process can often fail to prevent tape-out hurdles or extensive redesign. Therefore, forward-thinking design teams need to address reliability and power integrity long before final sign-off, accounting for their impact during the design process itself. Continue reading