European Microwave Week on the Horizon

European Microwave Week 2017 is almost upon us. The 6-day event provides access to the very latest products, research and initiatives in the microwave sector. It also offers attendees the opportunity for face-to-face interaction with those driving the future of microwave technology. Our ANSYS experts have been attending this conference for a number of years, and I’m proud to say we’ll be there again this year.

From October 10-12, you can stop by our Stand 103 to get the most up-to-date information on our solutions for RF, microwave and communications systems. I’m personally honored to be presenting two papers this year that I hope you’ll attend. Continue reading

ANSYS 18.2 Enhances Simulation Speed and Accuracy

ansys 18 2We continue to expand upon our best-in-class products and platform, and deliver on the Pervasive Engineering Simulation vision, with this week’s release of ANSYS 18.2. This latest release brings increased levels of accuracy, speed and ease-of-use — spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.

More companies are turning to simulation to drive increasingly rapid and innovative product development and gain deeper insight into product design.

“Our customers rely on ANSYS engineering simulation technology to cut costs, limit late-stage design changes, and tame the toughest engineering challenges. This latest release continues to build upon the industry’s most accurate simulation portfolio, offering enhanced speed and accuracy – enabling more users, no matter their level of experience, to reduce development time and increase product quality.” said Mark Hindsbo, ANSYS vice president and general manager.

Highlights of the release include: Continue reading

Amphenol® RF HFSS 3D Components

Amphenol® RF engineers spend countless hours working with our customers to ensure our connectors are as effectively integrated as possible to their products. With competitive pressure and new product development cycles shrinking ever more, efficient collaboration with customers and partners for successful product integration has never been more important. A critical challenge in high performance RF connector design is to understand the impact of the connector’s launch to the device. Being able to validate our connector design on the customer’s product as early and as confidently as possible in the design stage is critical. To help address this need, Amphenol® RF is now making available, for download, encrypted ANSYS HFSS 3D models. Continue reading