We continue to expand upon our best-in-class products and platform, and deliver on the Pervasive Engineering Simulation vision, with this week’s release of ANSYS 18.2. This latest release brings increased levels of accuracy, speed and ease-of-use — spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.
More companies are turning to simulation to drive increasingly rapid and innovative product development and gain deeper insight into product design.
“Our customers rely on ANSYS engineering simulation technology to cut costs, limit late-stage design changes, and tame the toughest engineering challenges. This latest release continues to build upon the industry’s most accurate simulation portfolio, offering enhanced speed and accuracy – enabling more users, no matter their level of experience, to reduce development time and increase product quality.” said Mark Hindsbo, ANSYS vice president and general manager.
Working for ANSYS gives me incredible opportunities to work with innovative companies and learn about the latest technologies that are being developed to improve our lives. One of the intriguing companies I have had the pleasure to work with is RF2ANTENNA. RF2ANTENNA works on developing innovative and easy-to-integrate products for specific applications in wireless communications and wireless charging, with the goal of improving the efficiency of IoT devices with affordable solutions. Their core competency is in providing solutions to radiation problems in mobile products. The ANSYS Startup Program has given them the opportunity to take their work to the next level. Continue reading →
Read any automotive-related article and I’m sure it discusses autonomous cars and Advanced Driver Assistance Systems (ADAS) – the benefits, the challenges and what the future may hold. More and more auto makers are moving towards autonomous developing vehicles, but many of the systems that will eventually be integrated into these vehicles to make them fully autonomous are being developed today. In fact, you probably have some of them in the car you are driving now — Collision Mitigation Braking, Lane Departure Warning, Blind Spot Warning, and Lane Keeping Assistance to name a few. These ADAS applications present a new set of challenges and require a multi-disciplinary development approach. You can read more about these development areas in a blog written by my colleague, Sandeep Sovani.
Recent advances in 3-D printing with metal have advanced to the point where antennas and RF components can be consistently fabricated with excellent performance in the millimeter wave frequencies. Optisys is a startup based in Utah that is focused on using the most advanced simulation tools to design antennas and radio-frequency (RF) components that could not have been fabricated a few years ago. The use of 3-D printing an antenna creates orders of magnitude reduction in size, weight, and lead time. These savings are enabled through a key partnership with the ANSYS Startup Program. Continue reading →
The concept of the “automated home and smart home” was first introduced over 80 years ago, and has been facing different technical limitations since then.
Recently, service providers and home appliance manufacturers have launched a new initiative to bring the concept of smart homes to reality allowing subscribers to remotely manage and monitor different home devices from anywhere via smart phones or over the web with no physical distance limitations. Continue reading →
For engineers designing integrated circuits (IC) including system on chips (SoC), using integration and miniaturization to increase performance and bandwidth while reducing power and footprint has been an ongoing, continuous strategy. Now TSMC has developed an InFO packaging technology that is truly a game changer!
Why is InFO technology a game changer?
As mobile phones and other handheld devices continue to be a key driver of semiconductor innovation, chips often go into systems that demand a small footprint and minimum height. Since wiring dimensions of a chip are much smaller than that on a board, a chip cannot be mounted directly on a board. Continue reading →
Looking back at the past couple of years of extraordinary joint engineering projects SGI and ANSYS have undertaken, it is clear to me that when a synergetic hardware and software partnership is established you, our joint customers, are the clear beneficiary. To that end, I would like to walk you through four such examples.
The first example was outlined over a year ago in my ANSYS guest blog, “Solving the Impossible Electromagnetic Simulation with HPC” where with a “grand challenge” benchmark we jointly demonstrated that the SGI® UV platform and ANSYS HFSS software could solve very large, high frequency electromagnetics problems like cosite analysis and radar cross section (RCS) analysis, as well as allow multiple frequency sweeps to be run without running out of computer system memory. Continue reading →
Antennas are the lifeblood of connected, mobile and many emerging IoT products. Consumers expect a reliable connection every time; anything short can kill a product launch or, worse yet, tarnish a corporate brand. That’s the market reality. The engineering reality is that there are significant engineering challenges associated with designing antennas and radio systems, including providing reliable connectivity and maintaining reasonable performance within an ever shrinking design footprint. Many of today’s devices need to operate in an increasingly crowded radio spectrum with the possibility of co-site conditions, operation near the human body and other challenging installed environments. Continue reading →
I’m excited to announce the release of ANSYS 17.2, the latest step in our unwavering commitment to push the boundaries of engineering simulation technology, so you can solve your most difficult product development challenges faster and more cost-effectively. No one can afford to wait in today’s fast-paced business environment, and our frequent release program ensures that you have the latest simulation solutions at your fingertips as soon as possible. Our goal is to deliver the best simulation tools on the planet when you need them, which is always now, not six months from now. So let’s cut to the chase. ANSYS 17.2 delivers many new advances across the portfolio, but here are a few of my favorites. Continue reading →
Wireless power transfer (WPT) is much researched and discussed in the context of IoT, electric vehicles and mobile electronic devices. The methodology of powering a device without a physical connection is well known. However, designing the coil shapes and their placement, maximizing efficiency and validating behavior at the system level still represent challenges that cannot be achieved without simulation. The next frontier to be explored is extending and applying wireless power transfer systems to more applications, such as continuous charging of multiple devices, increasing the range of efficient power transfer and ensuring the WPT system design meets regulatory guidelines. Continue reading →