As digital electronic devices continue to shrink and put greater functionality within consumer and enterprise products, thermal management continues to grow as the bottle neck for defining next generation architectures. Significant challenges exist today because the heat being generated continues to rise while the thermal envelope remains constant for silicon devices.
While some switching power converters have moved to III-V semiconductor materials such as GaN, the overall system still contains many silicon semiconductor devices that must meet traditional thermal envelopes. The removal of this heat has become a critical aspect of the design process, often being a very significant driver of what can be delivered within an electronic product. Continue reading
Many of our customers are reaping the benefits of the trace import functionality in ANSYS Mechanical, which accounts for the effects of copper distribution on every layer of a printed circuit board (PCB) — or printed circuit board assembled (PBA) — for your thermal stress analysis, modal, shock and random vibration simulations. Just think — you can capture the accuracy necessary to confidently make engineering decisions in a fraction of the time you are currently spending on lumped parameter models. In this post, I’ll give you a brief overview and explanation of the process. Continue reading
I’m excited to announce the release of ANSYS 17.2, the latest step in our unwavering commitment to push the boundaries of engineering simulation technology, so you can solve your most difficult product development challenges faster and more cost-effectively. No one can afford to wait in today’s fast-paced business environment, and our frequent release program ensures that you have the latest simulation solutions at your fingertips as soon as possible. Our goal is to deliver the best simulation tools on the planet when you need them, which is always now, not six months from now. So let’s cut to the chase. ANSYS 17.2 delivers many new advances across the portfolio, but here are a few of my favorites. Continue reading
Delivering a truly innovative product for the mobile revolution requires optimization at every level of design for power, performance, thermal and structural integrity. The success of today’s electronic products are tied to the success of their entire system, including all components from antenna to board, and from chip to chassis. Designing a smart watch, for example, requires multiple iterations of chip, package, board, antenna, and cooling strategy to arrive at a final optimized product. Continue reading
In the U.S., Groundhog Day is behind us; Phil saw his shadow and Spring looms ever closer. Last night the Ravens won the Superbowl and today the media is buzzing about the commercials, Beyonce’s half-time show and the power outage more than the plays on the field. But it’s Monday, and time to get back to the work at hand, so let’s turn our attention to the exciting line-up of ANSYS webinars and other events this week.
Full webinar descriptions below: Continue reading
We have seven ANSYS webinars for you to take advantage of this week where you can further your skills in your ANSYS software. Begin the week by gaining insight into the ANSYS Fluent Adjoint Solver, a groundbreaking new technology that ANSYS fluids customers are already beginning to take advantage of to help them improve their products quicker. Explore ANSYS Workbench, which provides a number of standard tools for structural mechanics simulations, or Ask The Expert about tips & tricks for modeling reacting flows.
And, if you’re on the road this week at DesignCon in Santa Clara, CA, stop by Booth 513 and say hello!
ANSYS Webinars Full Description & Registration Below
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Before I tell you about this week’s events, DID YOU KNOW that you can view past recordings of ANSYS webinars in our Resource Library? In case you missed a specific topic you’re interested in, you can also filter your results by Industry or Product. Why not catch up on all the great content our experts have put together for ANSYS users today!
While you’re there, I’d like to invite you to browse and find other technical briefs, conference papers and case studies of interest to you. If there’s something specific you’re looking for, please leave a comment on this blog post and I’ll see what I can find for you.
I just had an interesting conversation with some of my colleagues about thermal management of electronic devices. I asked them a very simple question: Why does my cell phone not heat up, even when I talk on it for an hour? They explained to me all of the challenges of cooling the electronic devices we use every day: computers, cell phones, tablets, pagers. (Oh no! I thought only the Flintstones still use a pager.)
Thermal Management is Essential
What I found most intriguing was how designers of these great products must look at both the heat generation of the device as a function of its usage (idle, in-use, charging) and the cooling system: They must neither under- nor over-design the cooling system. Or worse case, they must make sure that the device does not fail because components get too hot or “grill.” (See picture.)
We have a plethora of ANSYS webinars, face-to-face seminars and workshops this week. For instance, if you’re in or around Washington, DC for the NAFEMS North America Conference, we’d love to have you stop by our booth and say hello.
Below you’ll find a more comprehensive listing of ANSYS webinars and seminars. Make sure you register today for the events you’d like to attend. Continue reading
Our Ask the Expert series continues this week on the ANSYS Events Calendar along with several other events around the world. Just select the ones that fit your interest.
You must register in advance for webinars, but they are FREE to attend. In addition, recordings will be available after-the-fact for most webinars in our Resource Library.