ANSYS Chip Package System Analysis Ready for the “Next Big Thing” in Mobile Design

Delivering a truly innovative product for the mobile revolution requires optimization at every level of design for power, performance, thermal and structural integrity. The success of today’s electronic products are tied to the success of their entire system, including all components from antenna to board, and from chip to chassis. Designing a smart watch, for example, requires multiple iterations of chip, package, board, antenna, and cooling strategy to arrive at a final optimized product. Continue reading

Introducing ANSYS 17.0 – 10X Productivity, Insights and Performance

17.0With a number of emerging technologies and trends on the horizon, it is an exciting but challenging time to be an engineer. The convergence of new technologies into Industry 4.0 is ushering in an era of unbound product innovation. With the advent of the Internet of Things, a tighter integration of the digital world and the world of machines will profoundly transform consumer and industrial markets. New advanced materials are enabling engineers to create substantially lighter and sustainable designs. New technologies are changing the way we harvest, store, and use energy. And the possibilities of virtual reality and additive manufacturing are freeing engineers to explore more radical designs, free of manufacturing constraints. Make no mistake, engineering simulation will be the key to unlocking the power and potential of this new industrial revolution, and to this end, I am excited and honored to announce the next release of our simulation platform on behalf of over a thousand R&D professionals at ANSYS. Continue reading