Mention of EMI/EMC-induced automotive system failure in the press last week coincided with one of the bigger technical conferences held annually in Silicon Valley – DesignCon. It was in this conference two years ago that we organized a workshop on chip–package–system simulation methodologies specifically as they pertain to EMI/EMC analysis.
Electromagnetic interference, coupling and susceptibility are complex topics. To predict such an event or occurrence requires design teams separated by organizational boundaries to collaborate effectively “outside” the silos they reside in. An automotive system design company working on the next-generation air-bag control system will be responsible for designing the printed circuit board (PCB) to meet stringent performance, reliability and cost metrics. Its teams typically perform numerous simulations to ensure that the board, by itself, meets the requirements outlined for the team. However, PCBs are passive electrically. They (along with the cables) radiate only when the integrated circuit (IC) that is present on these PCBs performs the necessary operations and generates current flow through the various traces. Continue reading
(ASWC)
The Formula 1 engineer is the royal class of automotive engineering. Even the smallest improvements in aerodynamics, engine performance, traction or durability can influence a team’s success or failure. Each of the F1 teams have a large number of highly qualified engineers working on each part of the car to improve its overall performance. Where do these engineers come from? Is there a given educational path a person should follow to get a chance to work for an F1 team? Next to a sound engineering education and the right motivation and will, probably not. But there are some initiatives that are helpful on the way to the automotive engineering summit. One of them is Formula SAE/Formula Student. 