After completing the first circuit of the globe, this year the Automotive Simulation World Congress (ASWC) 2015 returns to Detroit. The conference is now exactly two weeks away — to be held on June 2 and 3 — and I am really excited about it. If you haven’t registered and reserved your seat, please take a moment to register. You don’t want to miss this great event. And if you don’t know what it’s all about, read on for more information. Continue reading
This is the third year that ANSYS hosted the Automotive Simulation World Congress (ASWC), an international conference focused on engineering simulation in the ground transportation industry. The ASWC is an annual conference that rotates between the three major regions of the world. In previous blogs, I wrote about the 2012 and 2013 ASWC’s held in Detroit and Frankfurt respectively. This year the conference was held in Tokyo on October 9 and 10. Continue reading
Imagine you have an oil pump in your car that has its outlet blocked. The pump is trying to throw the oil out but since the outlet is blocked the pressure in the pump keeps increasing. The excessive pressure that develops in the pump can be catastrophic to its strength and therefore life. This is precisely what happens when you try to operate the pump under extreme cold conditions, when the viscosity of the lubricant increases so much that the pump almost behaves as if its outlet has been blocked.
This is a very common design scenario for pump manufacturers. Estimation of what is called as “shut-off” pressure and its implications on the structural integrity of the pump are key concepts that every pump manufacturer should bear in mind while designing pumps. Interestingly, simulations today allow manufacturers to develop deep understanding of such phenomenon and help them to design pumps, that perhaps they could not have, with just physical testing and prototyping. Continue reading
Mention of EMI/EMC-induced automotive system failure in the press last week coincided with one of the bigger technical conferences held annually in Silicon Valley – DesignCon. It was in this conference two years ago that we organized a workshop on chip–package–system simulation methodologies specifically as they pertain to EMI/EMC analysis.
Electromagnetic interference, coupling and susceptibility are complex topics. To predict such an event or occurrence requires design teams separated by organizational boundaries to collaborate effectively “outside” the silos they reside in. An automotive system design company working on the next-generation air-bag control system will be responsible for designing the printed circuit board (PCB) to meet stringent performance, reliability and cost metrics. Its teams typically perform numerous simulations to ensure that the board, by itself, meets the requirements outlined for the team. However, PCBs are passive electrically. They (along with the cables) radiate only when the integrated circuit (IC) that is present on these PCBs performs the necessary operations and generates current flow through the various traces. Continue reading
Happy Friday, folks! This week’s roundup of interesting engineering technology news articles includes a look at how one engineering family celebrates the holiday season, more cool technology for your car and a high-level look at optimization with simulation.
- Wichitans’ Holiday Spirit Surges with Elaborate Light Displays
- New 4-D Transistor is Preview of Future Computers
- Petroski on Engineering: Design Begets Design
- A Computer for your Car’s Windshield
- The Twin Forces of Optimization and Inspiration
It was a short work week for us here in the U.S — Thanksgiving! The United States is a bit preoccupied with overindulging in Thanksgiving dinner, football watching, and shopping for the latest consumer gadgets on Black Friday, but we were able to find a few other important stories happening in the area of engineering technology. Enjoy!
- Advanced Auto Safety Features Should Be Standard in U.S
- Einstein’s Brain Reveals Clues to Genius
- Robots Are Marching into Homes
- Oak Ridge’s Titan Supercomputer is World’s Fastest
- Help for Small Nuclear Reactors
Happy Friday, folks! For this week’s roundup of interesting engineering technology news articles, be sure to check out Disney’s video showing how their engineers celebrate Halloween and learn how one British company is changing the world of energy as we know it. Oh, and turns out Cinderella’s glass slipper could indeed support her weight as she dances the night away with her prince charming!
- 24 Miles, 4 Minutes and 834 MPH, All in One Jump
- In Disneyland, Even A Gingerbread House Can Be Scary
- British Engineers Produce Amazing “Petrol From Air” Technology
- Engineer Solves Glass Slipper Dilemma
- Google Engineers Policing Governments Trying to Police Internet
On October 30 – 31, ANSYS will be hosting the Automotive Simulation World Congress (ASWC) in Detroit, Michigan. This international event is being held at the Detroit Marriott at the Renaissance Center and is solely focused on the automotive industry, including vehicles for road, rail, racetrack and off-highway and provides a forum for sharing and debating new practices, issues and industry trends. You’ll learning about the latest developments in engineering simulation applicable to the automotive industry, and networking with peers. Continue reading
The Formula 1 engineer is the royal class of automotive engineering. Even the smallest improvements in aerodynamics, engine performance, traction or durability can influence a team’s success or failure. Each of the F1 teams have a large number of highly qualified engineers working on each part of the car to improve its overall performance. Where do these engineers come from? Is there a given educational path a person should follow to get a chance to work for an F1 team? Next to a sound engineering education and the right motivation and will, probably not. But there are some initiatives that are helpful on the way to the automotive engineering summit. One of them is Formula SAE/Formula Student. Continue reading
Our Ask the Expert series continues this week on the ANSYS Events Calendar along with several other events around the world. Just select the ones that fit your interest.
You must register in advance for webinars, but they are FREE to attend. In addition, recordings will be available after-the-fact for most webinars in our Resource Library.
|June 26 – June 27||AIAA Fluid Dynamics Conference||New Orleans, Louisiana, United States||Trade Show|
|June 26||Automotive Powertrain Fluid-Structure Interaction (FSI)||Online||Webinar|
|June 27 –
|Forum Ter@tec – Simuler pour concevoir||Palaiseau, France||Trade Show|
|June 27 –
|2nd International Thermal Management Conference for EV/HEV||Darmstadt, Germany||Trade Show|
|June 27||Ask the Expert – Battery Cell Electrochemical and Thermal Modeling||Online||Webinar|
|June 27||Ask the Expert – Best Practices for Meshing Complex CAD Geometries in ANSYS Icepak||Online||Webinar|
|June 28||Automotive Powertrain Fluid-Structure Interaction (FSI)||Online||Webinar|