It always astounds me what our ANSYS customers accomplish with our software. Applying Pervasive Engineering Simulation, engineers, designers and students from organizations around the world and across a vast array of industries submitted a large number of innovative entries to be considered for the ANSYS Hall of Fame. It was very difficult for our judges to pick the winners among such great examples of engineering excellence.
Here are the winners of the 2018 ANSYS Hall of Fame Competition.
You may be surprised to learn that a standard passenger jet can have 30 to 50 antennas protruding from the aircraft’s external surface, producing drag forces that can drastically reduce fuel efficiency at a time when airlines are trying to reduce energy consumption. Most antenna designs are engineered for safety purposes, such as air traffic control, traffic collision avoidance, instrument landing systems and distance measuring equipment. Increasingly, antennas are being added to meet passenger demand for more and faster Wi-Fi access, in-flight TV and cellphone applications.
Antennas are mounted on the exterior of today’s airliners
Electronic devices — with well-designed signal integrity (SI) — have transformed the way we communicate, work, learn and entertain. Around the globe, we find smart phones, fiber-optic and wireless networks, pocket-size computers, LED screen displays that mimic paper and unmanned aerial vehicles (UAVs) that deliver packages. Automobiles are filled with electronics that control engine functions, keep wheels from skidding, avoid accidents, direct our travel routes and, now, drive themselves. Aircraft are equipped with radar, fly-by-wire systems and airborne communications. And the innovations keep coming…
Electronics are everywhere. Amazing innovations such as driver assistance systems (ADAS), IoT, 5G communications, hybrid propulsion and others all depend on electronics. Engineers and designers in almost every industry, must account for electromagnetic fields to design, optimize and deliver products quickly to market.
As radio frequency (RF) and wireless communications components are integrated into compact packages to meet smaller footprint requirements while improving power efficiency, electromagnetic field simulation is the only way to make these trade-offs. Simulation enables innovative ideas, that can push products beyond their traditional limits, to be tested and realized without the burden of prototype costs and time.
The latest issue of ANSYS Advantage features articles from industry leaders who make the most of electromagnetic field simulation to develop next-generation products and deliver them to market quickly.
Engineers are challenged to design modern electronic systems that operate at higher speeds with lower power with ever greater functionality in an ever shrinking footprint. These design challenges drive engineers to perform Chip-Package-System (CPS) co-design and analysis. However, the design flow is often unconnected, and design data is exchanged manually leading to slow design times and error prone design methodologies. ANSYS 18 breaks down the barriers between simulation domains and delivers a Chip-Package-System workflow that enables engineers to accomplish their work in a rapid and convenient way. Continue reading