Pervasive Simulation for Electronics in ANSYS Advantage

ansys advantage electronicsElectronics are everywhere. Amazing innovations such as driver assistance systems (ADAS), IoT, 5G communications, hybrid propulsion and others all depend on electronics. Engineers and designers in almost every industry, must account for electromagnetic fields to design, optimize and deliver products quickly to market.

As radio frequency (RF) and wireless communications components are integrated into compact packages to meet smaller footprint requirements while improving power efficiency, electromagnetic field simulation is the only way to make these trade-offs.  Simulation enables innovative ideas, that can push products beyond their traditional limits, to be tested and realized without the burden of prototype costs and time.

The latest issue of ANSYS Advantage features articles from industry leaders who make the most of electromagnetic field simulation to develop next-generation products and deliver them to market quickly.

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Chip-Package-System Workflow Breaks Down the Barriers in Electronics Design

Chip-Package-System Workflow Engineers are challenged to design modern electronic systems that operate at higher speeds with lower power with ever greater functionality in an ever shrinking footprint. These design challenges drive engineers to perform Chip-Package-System (CPS) co-design and analysis. However, the design flow is often unconnected, and design data is exchanged manually leading to slow design times and error prone design methodologies. ANSYS 18 breaks down the barriers between simulation domains and delivers a Chip-Package-System workflow that enables engineers to accomplish their work in a rapid and convenient way. Continue reading