ANSYS 18.2 Enhances Simulation Speed and Accuracy

ansys 18 2We continue to expand upon our best-in-class products and platform, and deliver on the Pervasive Engineering Simulation vision, with this week’s release of ANSYS 18.2. This latest release brings increased levels of accuracy, speed and ease-of-use — spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.

More companies are turning to simulation to drive increasingly rapid and innovative product development and gain deeper insight into product design.

“Our customers rely on ANSYS engineering simulation technology to cut costs, limit late-stage design changes, and tame the toughest engineering challenges. This latest release continues to build upon the industry’s most accurate simulation portfolio, offering enhanced speed and accuracy – enabling more users, no matter their level of experience, to reduce development time and increase product quality.” said Mark Hindsbo, ANSYS vice president and general manager.

Highlights of the release include: Continue reading

Chip-Package-System Design Approach

image showing chip-package-systemSince ANSYS acquired Apache Design last year, our team has been developing a chip-package-system (CPS) design approach that provides engineers with enough knowledge and confidence to make optimal cost, performance and reliability decisions for their designs.

Our simulation-driven CPS methodologies make it possible to provide the entire electronics supply chain with a more robust and reliable design that has greater predictability. This simulation flow enables engineers to resolve many or their toughest design challenges. The solution provides fully coupled chip-aware, physics-aware simulations for the chip-package-system design. The best-in-class dynamic power extraction solution from Apache Design is now coupled to industry-standard physical extraction simulators from ANSYS, providing full electromagnetic extraction, signal and power integrity, and electromagnetic interference analysis, as well as thermal, mechanical stress and other solutions needed as 3-D integrated circuit technologies become mainstream. Continue reading