Today we live in a hyper-connected world, surrounded by smart products. If industry forecasts are correct, by 2020 — just 2 short years from now — there will be over 28 billion internet-connected devices. Beyond smart phones and autonomous vehicles, smart cities, smart factories, and smart homes are also quickly emerging as promising opportunities that could help improve how we live, work and play.
While these new capabilities will be a delight to us as consumers, they are a nightmare for engineers and product designers. With hundreds of sensors, microprocessors, and wired and wireless communication components, engineers face immense challenges in ensuring reliability and performance. In the complex web of electronic circuitry, something, somewhere that is left unaddressed could lead to failure. One of the big challenges confronting product designers is electromagnetic interference, or EMI.
Full-wave model of communications channel
European Microwave Week 2017 is almost upon us. The 6-day event provides access to the very latest products, research and initiatives in the microwave sector. It also offers attendees the opportunity for face-to-face interaction with those driving the future of microwave technology. Our ANSYS experts have been attending this conference for a number of years, and I’m proud to say we’ll be there again this year.
From October 10-12, you can stop by our Stand 103 to get the most up-to-date information on our solutions for RF, microwave and communications systems. I’m personally honored to be presenting two papers this year that I hope you’ll attend. Continue reading
We continue to expand upon our best-in-class products and platform, and deliver on the Pervasive Engineering Simulation vision, with this week’s release of ANSYS 18.2. This latest release brings increased levels of accuracy, speed and ease-of-use — spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.
More companies are turning to simulation to drive increasingly rapid and innovative product development and gain deeper insight into product design.
“Our customers rely on ANSYS engineering simulation technology to cut costs, limit late-stage design changes, and tame the toughest engineering challenges. This latest release continues to build upon the industry’s most accurate simulation portfolio, offering enhanced speed and accuracy – enabling more users, no matter their level of experience, to reduce development time and increase product quality.” said Mark Hindsbo, ANSYS vice president and general manager.
Highlights of the release include: Continue reading
Since ANSYS acquired Apache Design last year, our team has been developing a chip-package-system (CPS) design approach that provides engineers with enough knowledge and confidence to make optimal cost, performance and reliability decisions for their designs.
Our simulation-driven CPS methodologies make it possible to provide the entire electronics supply chain with a more robust and reliable design that has greater predictability. This simulation flow enables engineers to resolve many or their toughest design challenges. The solution provides fully coupled chip-aware, physics-aware simulations for the chip-package-system design. The best-in-class dynamic power extraction solution from Apache Design is now coupled to industry-standard physical extraction simulators from ANSYS, providing full electromagnetic extraction, signal and power integrity, and electromagnetic interference analysis, as well as thermal, mechanical stress and other solutions needed as 3-D integrated circuit technologies become mainstream. Continue reading