Electronics are everywhere. Amazing innovations such as driver assistance systems (ADAS), IoT, 5G communications, hybrid propulsion and others all depend on electronics. Engineers and designers in almost every industry, must account for electromagnetic fields to design, optimize and deliver products quickly to market.
As radio frequency (RF) and wireless communications components are integrated into compact packages to meet smaller footprint requirements while improving power efficiency, electromagnetic field simulation is the only way to make these trade-offs. Simulation enables innovative ideas, that can push products beyond their traditional limits, to be tested and realized without the burden of prototype costs and time.
The latest issue of ANSYS Advantage features articles from industry leaders who make the most of electromagnetic field simulation to develop next-generation products and deliver them to market quickly.
Every new, smaller technology node developed in the semiconductor field has its own challenges, and the 7nm node is no exception. Usually a smaller technology node decreases price per transistor, but the cost benefits usually obtained from the smaller geometry are not as significant as in previous node changes. In fact, the increased complexity of lithography masks has made the unit cost per transistor slightly higher for 7nm devices. To offset these higher costs, products using 7nm semiconductors need higher margins, larger sales volumes and significantly higher performance than previous nodes. Achieving these goals requires designers to overcome a number of technical challenges, making upfront engineering simulation even more important than ever.
As one of today’s avionics system engineers, you have a difficult task — integrating a diverse range of functionally complex components, provided by multiple suppliers, into a system that is reliable enough to ensure consistent aircraft performance and passenger safety. You also need to understand and meet numerous regulatory operating systems and protocols, including ARINC 653, ARINC 429, CAN and ARINC 664. Continue reading →
Last summer, we shared with you some of the advances in ANSYS 16.2 as they related to virtual systems prototyping, including how you can optimize your product development process and improve collaboration among different departments and disciplines. I’m happy to let you know that we’ve continued to enhance our systems offering with the latest release of ANSYS Simplorer in ANSYS 17.0.
I’m personally most excited about the native support for Modelica in this new version of ANSYS Simplorer. Why? ANSYS Simplorer users will be delighted to know that you can create and assemble models faster than ever using Modelica models. Native support for the Modelica language allows you to import Modelica models directly into Simplorer. New library components provide access to hundreds of additional mechanical and fluid component models for complex electrified systems. Continue reading →
The proliferation of electronics into every product arena can’t be denied. Electronics bring huge benefits in terms of features and functionality to pretty much any device. This means that electronics are being placed in more varied environments — and subjected to more demanding loads — than ever before. Continue reading →
I was speaking with an ANSYS HFSS developer about a year ago when he mentioned they were starting to see customers who wanted to run 3-D full wave electromagnetic field simulations that would need more than a terabyte of computer system memory, something this developer hadn’t been able to do before. Continue reading →
After completing the first circuit of the globe, this year the Automotive Simulation World Congress (ASWC) 2015 returns to Detroit. The conference is now exactly two weeks away — to be held on June 2 and 3 — and I am really excited about it. If you haven’t registered and reserved your seat, please take a moment to register. You don’t want to miss this great event. And if you don’t know what it’s all about, read on for more information. Continue reading →
Today marks the 5th anniversary of IoT Day. Communities around the world are hosting events that facilitate “conversations around technologies, security, data privacy and the enormous potential that an “Internet of Things” is capable of.” Why does it matter? Because the IoT connectivity boom is transforming how products are designed, delivered, serviced, and consumed. Continue reading →
I’ve got a lot to say about Systems Engineering for Smart Products, so this is the first in a series of blogs. In nearly every industry, consumers are benefiting from the evolution of smart products. These are highly-engineered, multi-functional products that interact with people and their environments in new ways to ensure our safety, improve efficiency or reduce energy consumption. Under the hood of every smart product is a complex system (or a series of subsystems) of micro-electronics, embedded software and advanced sensor technology that have to operate in unison to measure operating conditions, predict future events, communicate with other devices, and respond to changes faster and more accurately.
Engineering these systems into a commercially viable product is far from trivial. Today’s smart products have thousands of unique requirements that need to be served by a multiplicity of subsystems and components. Each component may have hundreds of design parameters and multiple interfaces that need to be engineered, verified and validated. The endless design dimensions present opportunities for innovation, as well as for design failures, which may result in recalls, lost revenue and a tarnished corporate brand. Continue reading →
Nearly every industry today deals with issues of an increasingly complex supply chain, representing interconnected relationships between OEMs, and their Tier 1, 2 and 3 suppliers. Customers who perform simulation driven product development are acutely aware of the supply chain issues, because simulation tools used by various companies are usually different and often not interoperable. This is where standards come in — modeling standards like the IEEE VHDL-AMS language provide a clear modifiable description of behavior and all tools that support this language are expected to behave the same way. However, since each tool provides its own implementation of the language compiler (typically converting from the standard modeling language to C++ code), there can be some differences in behavior. Continue reading →