10X Gain in Productivity of Chip‐level Power Integrity Analysis

The internet has inspired the growth and permeation of electronics into everything from coffee machines to automobiles, hand‐held devices, mobile smart phones, healthcare monitoring and treatment equipment, communication devices, high‐end servers and more. Most of these are “always on,” and require the systems on chip (SoC) that drive the electronics to be: Continue reading

Achieving Power Noise Closure and Reliability Sign-off Accuracy for SoCs using Advanced Process Technologies

TSMC’s Partner of the Year Award

TSMC’s Partner of the Year Award

This year, ANSYS received yet another TSMC’s Partner of the Year Award in the category of joint development of the 10nm FinFET Design Infrastructure.  It has been 11 years since TSMC adopted ANSYS RedHawk as an integral part of its Reference Flow 5.0 in 2004, and that was the industry’s first reference flow to achieve dynamic power noise closure for nanometer designs.

Through longstanding, close collaboration between TSMC and ANSYS, ANSYS RedHawk and ANSYS Totem have always been enabled as power integrity and reliability solutions for the most advanced process technology. This has played and continues to play a critical role, enabling mutual customers to innovate and creating revolutionary electronic devices — for smart phones, high-performance computing, automotive, and wearable applications. Continue reading