ANSYS Chip Package System Analysis Ready for the “Next Big Thing” in Mobile Design

Delivering a truly innovative product for the mobile revolution requires optimization at every level of design for power, performance, thermal and structural integrity. The success of today’s electronic products are tied to the success of their entire system, including all components from antenna to board, and from chip to chassis. Designing a smart watch, for example, requires multiple iterations of chip, package, board, antenna, and cooling strategy to arrive at a final optimized product. Continue reading

Automotive, the Ultimate Connected ‘Device’

The Internet of Things (IoT) is about connected devices, and those devices are not just smartphones, tablets and phablets. It is anything that can collect data (sensors), connect to the internet and transmit the data wirelessly (antennas), and make smart decisions on acquired data (embedded software / processors). The biggest “mobility device” happens to be one that is near and dear to Americans — the car. Over the last few years the amount of electronics and connectivity within a car has been rapidly growing making it a primary differentiator for an automobile. Continue reading

There’s a Power Battle Going On with the Internet of Things

What do antennas, sensors and integrated circuits all have in common in an IoT-connected device? They are all fighting for the same power supply resources. Indeed, power consumption may be the biggest challenge facing designers of mobile devices for the Internet of Things. As battery sizes shrink to allow for smaller form-factors, battery lifetime becomes critical to meeting cost, performance, and reliability requirements. Continue reading