Have you ever heard the story of David and Goliath? The old tale tells of how the young David defeated the mighty giant Goliath with daring and clever methods instead of traditional ones. At ReVibe Energy, we’ve been inspired by the story.
Now, we’re not aiming to triumph over our competitors using the same means David used against Goliath, but rather to attract potential customers through innovative and agile methods. By using engineering simulation software from ANSYS we can distinguish ourselves from our competitors and offer current and prospective customers better products in a shorter amount of time.
One of the most important problems in the automotive industry is the general multiphysics simulation of coupled phenomena, where multiple — and sometimes conflicting — conditions need to be accounted for, all at the same time. One common application is the resistive heating of a car side mirror.
Designing the mechanism for keeping the mirror defrosted must also take into account the structural response of the mirror as the external environmental conditions, such as air pressure and cold temperature, cause physical stress and thermal deformation. The task is a base requirement of the automotive industry and requires a full multiphysics approach, which is still a challenge for common finite element method (FEM) simulation. In this post, we’ll show you how our engineers at SVS FEM used ANSYS AIM to model a side mirror and multiphysics analysis to solve some of its difficult design problems. Continue reading →
Global prosperity requires reliable energy at a reasonable cost. To meet this demand, the industry is changing the way it produces energy and power, whether it comes from hydrocarbon, nuclear or renewable means. Supplying it requires sustainable development, environmental stewardship, compliance with regulations and cost management. Independent of prices, the industry’s most pressing challenge is cost per unit of energy. Recent layoffs and out-of-the ordinary cuts to capital and operating costs are driving the oil and gas industry to produce energy more efficiently, more safely, and with a smaller carbon footprint. Debate over subsidies, reliability and viability have resulted in accelerated development/deployment and widespread innovation in renewable energy, which includes solar, wind and hydropower, fuel cells, wave and tidal, energy storage, the next generation of fission nuclear reactors and advancements in fusion energy. Continue reading →
According to Gartner, designing, testing and manufacturing 7nm FinFET-based system on a chip (SoC) requires massive resources: as much as $270 million and 500 man-years to bring the chip to market. Encapsulating such chips within a 2.5/3D package such as InFO-WLP improves power, performance and form factor while increasing the cost of design. To make a profit on that level of investment, the market for these chips tend to be high-end mobile and enterprise applications. To satisfy customer needs in these demanding markets, design teams have to deliver highly integrated devices that operate seamlessly and reliably for long periods of time. Additionally, you have to reduce the engineering time and cost, and ensure “first-time” working silicon. To do this you will need to move away from the traditional silo-based design flow to a chip-package-board co-simulation workflow and methodology. Continue reading →
Throughout my 25 years in the computer-aided engineering industry, some of the smartest people I know have told me that you can’t use simulation to design planar magnetic transformers. Is it true? No! What they’re really saying is that there isn’t an effective way to simulate the devices to predict the full behavior — which includes electromagnetic losses, harmonic content, EM-thermal coupling and ultimately how the electromagnetic fields and temperature affect the circuit — in a reasonable amount of time for simulation to be an effective design tool. Continue reading →
Wireless power transfer (WPT) is much researched and discussed in the context of IoT, electric vehicles and mobile electronic devices. The methodology of powering a device without a physical connection is well known. However, designing the coil shapes and their placement, maximizing efficiency and validating behavior at the system level still represent challenges that cannot be achieved without simulation. The next frontier to be explored is extending and applying wireless power transfer systems to more applications, such as continuous charging of multiple devices, increasing the range of efficient power transfer and ensuring the WPT system design meets regulatory guidelines. Continue reading →
Due to the volumes of data that need to be analyzed and the limits in simulation tool capabilities and processing power, sign-off in chip and electronic system design has traditionally followed a monolithic, margin-based approach that has resulted in larger die-size and longer development times. Today I’d like to tell you about a fundamentally new approach and software architecture called ANSYS SeaScape that will revolutionize chip simulation by harnessing the power of elastic computing, machine learning and big data to perform multiphysics simulations and design more compact, complex chips. This approach has demonstrated its ability speed up chip design and help eliminate many of the inefficiencies of traditional methodologies. Continue reading →
Most modern companies know that simulation provides significant benefits in the design engineering phase of new products. Early in the design phase, 3D models that only exist virtually can be optimized with nearly no incremental cost incurred for each new design simulated. Many companies have analysts that use simulation and reap the productivity benefits. We see evidence of this in simulation news and publications, in the ANSYS blog and in ANSYS Advantage magazine. Many companies would like more of their design engineers to use simulation and to better integrate design engineering teams in their simulation strategies. The challenge has been finding simulation products suited to the available time and experience level of design engineers that provide quick reliable, accurate results in support of engineering goals. Continue reading →
On January 27, ANSYS released its biggest version ever, ANSYS 17.0. Although the ANSYS simulation platform is renowned for its comprehensive coverage of virtually every industry through its extensive range of simulation tools, this latest release is particularly suited for the healthcare industry, whether you are modeling structural, fluid or electromagnetic applications — not to mention those of you engaged with multiphysics modeling. Among the hundreds of new features coming with this release, it might be easy to miss those which are truly important for the medical device, pharmaceutical or clinical sectors. Let me highlight 3 new or enhanced capabilities. Continue reading →
Preparing students for the real world means introducing them to industry-standard tools such as ANSYS AIM — as early as sophomore year.
Undergraduate engineering students are incredibly busy, overloaded with curricular activities. My mechanical and mechatronics engineering students carry a load of five courses in such complex subjects as mathematics, physics, materials, thermal science, and automation and control. Every four months, they also complete a co-operative education term in industry.
Because undergrads are so busy, I was shocked two years ago when a group of second-year students approached me about incorporating a new project into an already-challenging class, numerical methods. Continue reading →