Many of our customers are reaping the benefits of the trace import functionality in ANSYS Mechanical, which accounts for the effects of copper distribution on every layer of a printed circuit board (PCB) — or printed circuit board assembled (PBA) — for your thermal stress analysis, modal, shock and random vibration simulations. Just think — you can capture the accuracy necessary to confidently make engineering decisions in a fraction of the time you are currently spending on lumped parameter models. In this post, I’ll give you a brief overview and explanation of the process. Continue reading
With the release of ANSYS 16.0 last week, we know that you may be looking for more detail around “What’s New”. Our team of experts have put together a series of webinars over the coming weeks that will take a deeper dive into the enhancements you’ll see.
Register today for the webinar(s) that spark your interest. Continue reading
The battle is on for manufacturers of automotive, medical, industrial and consumer electronics to drive new innovations, deliver exciting products, and ensure safety and reliability of the devices that proliferate our world. Mobile devices that are intended to interact with our world face unique reliability challenges such as electrostatic discharge (ESD) protection, making a robust ESD design a necessity. While we want our mobile phone, tablet and smartwatch to be “connected” and “interactive”, the number of interface ports on these devices make them vulnerable to an ESD event. Interfaces such as network connectors, USB ports, and antennas need careful planning of the location and size of ESD protection structures. Continue reading