I just had an interesting conversation with some of my colleagues about thermal management of electronic devices. I asked them a very simple question: Why does my cell phone not heat up, even when I talk on it for an hour? They explained to me all of the challenges of cooling the electronic devices we use every day: computers, cell phones, tablets, pagers. (Oh no! I thought only the Flintstones still use a pager.)
Thermal Management is Essential
What I found most intriguing was how designers of these great products must look at both the heat generation of the device as a function of its usage (idle, in-use, charging) and the cooling system: They must neither under- nor over-design the cooling system. Or worse case, they must make sure that the device does not fail because components get too hot or “grill.” (See picture.)
This is why innovative multiphysics simulation, which couples electromagnetics and fluid simulation, is so important! Electromagnetic simulation is used to determine the heating, while fluid simulation is used to determine the performance of the cooling system. I am proud to be working at ANSYS because we develop such solutions —such as to make sure my cell phone does not burn my hand when I talk too much. (OK, some people would admit that it might be a good thing, as it would make me shut up.)
Instead of asking my colleagues all the questions about these great technologies, I will attend the webinar that they will conduct on October 24 at 9 a.m. eastern time (14:00 London time). The session will be repeated on November 14 at 4 p.m. eastern time (21:00 London time). In this webinar, I expect to learn about the new capabilities of ANSYS Icepak to connect with ANSYS HFSS and Apache’s Sentinel-TI.
So, if like me, you are curious about how simulation helps in the design of electronic components that must stay cool, attend the free webinars!
Wednesday, October 24 (9 a.m. eastern, 14:00 London time)
Wednesday, November 14 (4 p.m. eastern, 21:00 London time)