Exciting new capabilities have just been released in ANSYS HFSS 19. With this release, we are delivering new features such as Radar Cross Section Analysis (RCS), a dynamic new user interface, more computational power and new packaging that will deliver an incredible amount of value to our current and future users. In this blog, I provide a brief introduction to the new HFSS but please consider joining my colleague Matt Commens, HFSS Lead Product Manager, on February 7 for the HFSS Product Update Web Seminar to find out even more details. Continue reading
Electronics are everywhere. Amazing innovations such as driver assistance systems (ADAS), IoT, 5G communications, hybrid propulsion and others all depend on electronics. Engineers and designers in almost every industry, must account for electromagnetic fields to design, optimize and deliver products quickly to market.
As radio frequency (RF) and wireless communications components are integrated into compact packages to meet smaller footprint requirements while improving power efficiency, electromagnetic field simulation is the only way to make these trade-offs. Simulation enables innovative ideas, that can push products beyond their traditional limits, to be tested and realized without the burden of prototype costs and time.
The latest issue of ANSYS Advantage features articles from industry leaders who make the most of electromagnetic field simulation to develop next-generation products and deliver them to market quickly.
Throughout my 25 years in the computer-aided engineering industry, some of the smartest people I know have told me that you can’t use simulation to design planar magnetic transformers. Is it true? No! What they’re really saying is that there isn’t an effective way to simulate the devices to predict the full behavior — which includes electromagnetic losses, harmonic content, EM-thermal coupling and ultimately how the electromagnetic fields and temperature affect the circuit — in a reasonable amount of time for simulation to be an effective design tool. Continue reading
Electric machines, power and electronic transformers and other devices can be better designed and analyzed using transient electromagnetic field simulation. This choice allows engineers to analyze the dynamic system including the non-linear materials, permanent magnets and induced eddy current under a variety of conditions, employing various excitations including the pulsed waveform. Continue reading
The recent ANSYS acquisition of Delcross Technologies is a very exciting addition to our electronics product portfolio! The Internet of Things (IoT), aerospace and defense electronics, including unmanned aerial vehicles (UAVs), automotive radar and autonomous vehicles all have increasing use of multiple antennas and wireless services.
ANSYS HFSS delivers capabilities that enable antennas to be placed on complex structures followed by efficient simulation using component library models with encryption, assembly modeling with mesh assembly, and advances in our hybrid solver technology. The next logical step in HFSS development is to perform even larger platform-level simulations. To solve larger problems requires leveraging asymptotic methods of which one of the most powerful and effective method is the Shooting and Bouncing Ray (SBR) technique. The Delcross implementation of the SBR technique and its integration with high-level system analysis is the most advanced in the world and is now a part of the ANSYS product portfolio! ANSYS has fast-forwarded its development plan and will now offer our customers the ability to solve massively large antenna simulations; installed antenna performance and system RF co-site problems. Continue reading
ANSYS had an exciting week at DesignCon 2014 in Santa Clara, California a couple of weeks ago. After MANY hours of demos, networking, panel discussions, award dinners and paper presentations, we are back in action and ready to take what we learned about the latest industry trends and challenges and see how we can apply it to ANSYS simulation.
At the show, we announced a new suite of electronic products designed to help users quickly identify potential power and signal integrity problems throughout the PCB design flow. Attendees of our in booth presentations on the new SIwave were excited to see the new targeted capabilities and design flows to address such critical issues as DC voltage drop analysis, power integrity and automated decoupling capacitor optimization and end-to-end signal integrity analysis design flow. Continue reading
ANSYS is excited to exhibit at DesignCon 2014 in Santa Clara,CA on January 29 and 30 and we have some very exciting reasons you should register to attend and stop by booth #513 to talk to our signal integrity, power integrity and EM experts! Here are just a few.
Live Presentation: The Future of Power Integrity and the Implications on Signal Integrity and EMI at 2:00 and 4:00 daily.
As technology continues to evolve towards realizing the “Internet of Things”, so must the underlying design tools. ANSYS has updated our signal integrity and power integrity analysis solution portfolio. Stop by for a short presentation on the important new changes coming to SIwave and HFSS that will propel future applications of PI/SI and EMI. Continue reading
Since ANSYS acquired Apache Design last year, our team has been developing a chip-package-system (CPS) design approach that provides engineers with enough knowledge and confidence to make optimal cost, performance and reliability decisions for their designs.
Our simulation-driven CPS methodologies make it possible to provide the entire electronics supply chain with a more robust and reliable design that has greater predictability. This simulation flow enables engineers to resolve many or their toughest design challenges. The solution provides fully coupled chip-aware, physics-aware simulations for the chip-package-system design. The best-in-class dynamic power extraction solution from Apache Design is now coupled to industry-standard physical extraction simulators from ANSYS, providing full electromagnetic extraction, signal and power integrity, and electromagnetic interference analysis, as well as thermal, mechanical stress and other solutions needed as 3-D integrated circuit technologies become mainstream. Continue reading