In a previous blog, I noted that born in the cloud companies can be a boon to tech startups looking to optimize precious resources. In this post, I offer a spectacular case in point.
Optisys had big goals and big compute needs. Designing its next-gen antenna, the Utah-based startup sought order-of-magnitude reductions in size, weight and lead time, and a cost-effective solution for running large, concurrent RF electronics simulations. Establishing an in-house IT function wasn’t an option: Optisys (like many startups) had little appetite or budget for investing outside its core business. Instead, it adopted Rescale’s cloud-based platform to satisfy its simulation needs. Continue reading →
You may be surprised to learn that a standard passenger jet can have 30 to 50 antennas protruding from the aircraft’s external surface, producing drag forces that can drastically reduce fuel efficiency at a time when airlines are trying to reduce energy consumption. Most antenna designs are engineered for safety purposes, such as air traffic control, traffic collision avoidance, instrument landing systems and distance measuring equipment. Increasingly, antennas are being added to meet passenger demand for more and faster Wi-Fi access, in-flight TV and cellphone applications.
Antennas are mounted on the exterior of today’s airliners
Electronic devices — with well-designed signal integrity (SI) — have transformed the way we communicate, work, learn and entertain. Around the globe, we find smart phones, fiber-optic and wireless networks, pocket-size computers, LED screen displays that mimic paper and unmanned aerial vehicles (UAVs) that deliver packages. Automobiles are filled with electronics that control engine functions, keep wheels from skidding, avoid accidents, direct our travel routes and, now, drive themselves. Aircraft are equipped with radar, fly-by-wire systems and airborne communications. And the innovations keep coming…
The role of 3-D physics, systems simulation and embedded software is expanding rapidly into new industries and disciplines. A few years ago, 3-D physics simulation was limited to specific departments within organizations, and often these departments did not coordinate with each other on product development activities. Fast forward to today, and much has changed and must continue to evolve in order for companies to remain competitive in the changing landscape of product development. Integrated 3-D physics, systems simulation and embedded software tools are of the utmost importance — especially when tackling the challenges of quickly and accurately developing the technology driving digital twins and autonomous vehicles.
Join us in Paris for our Innovations Conference on December 5-6 and learn how our customers are using simulation to bring their products to market faster.
We continue to expand upon our best-in-class products and platform, and deliver on the Pervasive Engineering Simulation vision, with this week’s release of ANSYS 18.2. This latest release brings increased levels of accuracy, speed and ease-of-use — spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.
More companies are turning to simulation to drive increasingly rapid and innovative product development and gain deeper insight into product design.
“Our customers rely on ANSYS engineering simulation technology to cut costs, limit late-stage design changes, and tame the toughest engineering challenges. This latest release continues to build upon the industry’s most accurate simulation portfolio, offering enhanced speed and accuracy – enabling more users, no matter their level of experience, to reduce development time and increase product quality.” said Mark Hindsbo, ANSYS vice president and general manager.
Working for ANSYS gives me incredible opportunities to work with innovative companies and learn about the latest technologies that are being developed to improve our lives. One of the intriguing companies I have had the pleasure to work with is RF2ANTENNA. RF2ANTENNA works on developing innovative and easy-to-integrate products for specific applications in wireless communications and wireless charging, with the goal of improving the efficiency of IoT devices with affordable solutions. Their core competency is in providing solutions to radiation problems in mobile products. The ANSYS Startup Program has given them the opportunity to take their work to the next level. Continue reading →
Read any automotive-related article and I’m sure it discusses autonomous cars and Advanced Driver Assistance Systems (ADAS) – the benefits, the challenges and what the future may hold. More and more auto makers are moving towards autonomous developing vehicles, but many of the systems that will eventually be integrated into these vehicles to make them fully autonomous are being developed today. In fact, you probably have some of them in the car you are driving now — Collision Mitigation Braking, Lane Departure Warning, Blind Spot Warning, and Lane Keeping Assistance to name a few. These ADAS applications present a new set of challenges and require a multi-disciplinary development approach. You can read more about these development areas in a blog written by my colleague, Sandeep Sovani.
Recent advances in 3-D printing with metal have advanced to the point where antennas and RF components can be consistently fabricated with excellent performance in the millimeter wave frequencies. Optisys is a startup based in Utah that is focused on using the most advanced simulation tools to design antennas and radio-frequency (RF) components that could not have been fabricated a few years ago. The use of 3-D printing an antenna creates orders of magnitude reduction in size, weight, and lead time. These savings are enabled through a key partnership with the ANSYS Startup Program. Continue reading →
The concept of the “automated home and smart home” was first introduced over 80 years ago, and has been facing different technical limitations since then.
Recently, service providers and home appliance manufacturers have launched a new initiative to bring the concept of smart homes to reality allowing subscribers to remotely manage and monitor different home devices from anywhere via smart phones or over the web with no physical distance limitations. Continue reading →
For engineers designing integrated circuits (IC) including system on chips (SoC), using integration and miniaturization to increase performance and bandwidth while reducing power and footprint has been an ongoing, continuous strategy. Now TSMC has developed an InFO packaging technology that is truly a game changer!
Why is InFO technology a game changer?
As mobile phones and other handheld devices continue to be a key driver of semiconductor innovation, chips often go into systems that demand a small footprint and minimum height. Since wiring dimensions of a chip are much smaller than that on a board, a chip cannot be mounted directly on a board. Continue reading →