In part one of this series, we discussed modeling approaches for the complex geometry found in printed circuit boards. Now, we’ll move on to discussing methods for characterizing the thermal properties of integrated circuit (IC) packages.
Analysis of IC packages is critical at many levels of the design process, including package level thermal design, board level modeling including heat sink designs and package viability, as well as system level flow and thermal characterization. Much like a PCB, IC packages are geometrically complex, with disparate length scales that are challenging to explicitly capture in an analysis.
Typical IC Packages Continue reading
Electronics is at the heart of many exciting products like smartphones, tablets, and TVs, and it plays a key role in various industries from semiconductor, automotive, agriculture, aerospace, entertainment to healthcare. Modern electronic devices are faster, smaller, and denser than ever before. Since we pack millions of transistors within a small area, these devices tend to generate a lot of heat. Heat-induced mechanical effects, such as delamination, and breakage of solder joints connecting the chips to their printed circuit boards (PCBs), can cause system-wide reliability problems. It’s critical to simulate the electro-thermal and structural properties of electronic designs before you build the hardware. Simulation tools from ANSYS can solve these challenges and improve the reliability and performance of electronic products. Continue reading
I think you know the story because you are living it every day. It’s not enough anymore to use the most accurate physical models in your simulations (although you won’t give them up!). Your product challenge is vastly more complicated than that. You’re under unrelenting pressure to lower cycle times and reduce costs, while increasing quality and eliminating risk. That calls for more.
That’s why we are so proud of ANSYS 19. We designed it to help you tame complexity and enhance productivity, so you can address your whole product challenge with greater accuracy — across the broadest range of applications.
ANSYS 19 is how we are making simulation even more pervasive.
As digital electronic devices continue to shrink and put greater functionality within consumer and enterprise products, thermal management continues to grow as the bottle neck for defining next generation architectures. Significant challenges exist today because the heat being generated continues to rise while the thermal envelope remains constant for silicon devices.
While some switching power converters have moved to III-V semiconductor materials such as GaN, the overall system still contains many silicon semiconductor devices that must meet traditional thermal envelopes. The removal of this heat has become a critical aspect of the design process, often being a very significant driver of what can be delivered within an electronic product. Continue reading
Many of our customers are reaping the benefits of the trace import functionality in ANSYS Mechanical, which accounts for the effects of copper distribution on every layer of a printed circuit board (PCB) — or printed circuit board assembled (PBA) — for your thermal stress analysis, modal, shock and random vibration simulations. Just think — you can capture the accuracy necessary to confidently make engineering decisions in a fraction of the time you are currently spending on lumped parameter models. In this post, I’ll give you a brief overview and explanation of the process. Continue reading
I’m excited to announce the release of ANSYS 17.2, the latest step in our unwavering commitment to push the boundaries of engineering simulation technology, so you can solve your most difficult product development challenges faster and more cost-effectively. No one can afford to wait in today’s fast-paced business environment, and our frequent release program ensures that you have the latest simulation solutions at your fingertips as soon as possible. Our goal is to deliver the best simulation tools on the planet when you need them, which is always now, not six months from now. So let’s cut to the chase. ANSYS 17.2 delivers many new advances across the portfolio, but here are a few of my favorites. Continue reading
Delivering a truly innovative product for the mobile revolution requires optimization at every level of design for power, performance, thermal and structural integrity. The success of today’s electronic products are tied to the success of their entire system, including all components from antenna to board, and from chip to chassis. Designing a smart watch, for example, requires multiple iterations of chip, package, board, antenna, and cooling strategy to arrive at a final optimized product. Continue reading
In the U.S., Groundhog Day is behind us; Phil saw his shadow and Spring looms ever closer. Last night the Ravens won the Superbowl and today the media is buzzing about the commercials, Beyonce’s half-time show and the power outage more than the plays on the field. But it’s Monday, and time to get back to the work at hand, so let’s turn our attention to the exciting line-up of ANSYS webinars and other events this week.
Full webinar descriptions below: Continue reading
We have seven ANSYS webinars for you to take advantage of this week where you can further your skills in your ANSYS software. Begin the week by gaining insight into the ANSYS Fluent Adjoint Solver, a groundbreaking new technology that ANSYS fluids customers are already beginning to take advantage of to help them improve their products quicker. Explore ANSYS Workbench, which provides a number of standard tools for structural mechanics simulations, or Ask The Expert about tips & tricks for modeling reacting flows.
And, if you’re on the road this week at DesignCon in Santa Clara, CA, stop by Booth 513 and say hello!
ANSYS Webinars Full Description & Registration Below
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Before I tell you about this week’s events, DID YOU KNOW that you can view past recordings of ANSYS webinars in our Resource Library? In case you missed a specific topic you’re interested in, you can also filter your results by Industry or Product. Why not catch up on all the great content our experts have put together for ANSYS users today!
While you’re there, I’d like to invite you to browse and find other technical briefs, conference papers and case studies of interest to you. If there’s something specific you’re looking for, please leave a comment on this blog post and I’ll see what I can find for you.