Improve Thermal Reliability with ANSYS Icepak

Electronics is at the heart of many exciting products like smartphones, tablets, and TVs, and it plays a key role in various industries from semiconductor, automotive, agriculture, aerospace, entertainment to healthcare. Modern electronic devices are faster, smaller, and denser than ever before. Since we pack millions of transistors within a small area, these devices tend to generate a lot of heat. Heat-induced mechanical effects, such as delamination, and breakage of solder joints connecting the chips to their printed circuit boards (PCBs), can cause system-wide reliability problems. It’s critical to simulate the electro-thermal and structural properties of electronic designs before you build the hardware. Simulation tools from ANSYS can solve these challenges and improve the reliability and performance of electronic products. Continue reading