From China to Germany to France and the U.S., there’s sure to be a few ANSYS webinars that will catch your interest. Please select a topic below and register today. If you are not able to attend the webinar live, you will receive a link to the recording within a few days after the event. Continue reading
This week you can learn about how ANSYS and Intel® teamed to optimize ANSYS Mechanical for the latest Intel processor and coprocessor innovations. Based on these efforts, both the Windows and Linux versions of ANSYS Mechanical 16.0 (including the SMP and DMP versions of each) can now utilize one or more Intel Xeon Phi coprocessors. With Intel’s special promotion and ANSYS HPC Workgroups, you can take advantage of Intel coprocessor performance within your qualified existing hardware at a significantly discounted price.
In our ANSYS webinars line-up this week, we continue the conversation about our latest software releases. ANSYS 16.0 delivers an all new ANSYS Electronics Desktop featuring ANSYS HFSS and the industry’s first 3-D EM component library. During this webinar, we will introduce you to features in the desktop and illustrate how engineers and CAD support teams can use the new 3-D EM component library. Continue reading
March arrived like a lion here in Pennsylvania, with snow and rain and ice. If you’re in a part of the World where the weather is harsh, you’re going to want to check out the ANSYS webinars that you can attend from the comfort of you home or office.
This week, we have a special guest joining us. Troyce Severe, EDA Systems Engineer at Qorvo, will present how the combination of SGI® UV™ hardware solutions and ANSYS HFSS helps them simulate a wide range of EM designs from single chips to complete module laminate assemblies. Continue reading
Can you believe it’s the last week in February already? Here’s hoping that your year has gotten off to a great start and that you’ve been able to attend some of the great ANSYS webinars our experts have been putting together for you.
All of our ANSYS webinars feature a LIVE Q&A at the end of each session, so bring your questions! Continue reading
This week we continue our ANSYS webinars series focused on the newest features and enhancement you’ll find in ANSYS 16.0 products.
ANSYS Icepak simulates thermal and fluid flow in ICs and PCBs, including all modes of heat transfer — conduction, convection and radiation — for steady-state and transient electronics cooling applications. ANSYS Maxwell is the premier low-frequency electromagnetic field simulation software for designing and analyzing 3-D and 2-D electromagnetic and electromechanical devices. Continue reading
With the recent release of ANSYS 16.0, we’re pleased to provide our users with a line-up of ANSYS webinars that will focus on new features and benefits. Each webinar includes a live Q&A where our experts will take your questions. Please register today for the webinars that best suit your needs.
As always, a full calendar of events can be found on our website.
With the release of ANSYS 16.0 last week, we know that you may be looking for more detail around “What’s New”. Our team of experts have put together a series of webinars over the coming weeks that will take a deeper dive into the enhancements you’ll see.
Register today for the webinar(s) that spark your interest. Continue reading