Speeding Innovation – Advancements in High Tech Simulation with ANSYS 17.0

It isn’t too much of a stretch to say that Moore’s Law can be credited with many of our technological advances. Since the 1960s, Gordon Moore’s prediction that computing performance will double every 12 to 18 months has been accepted as gospel. And the proof is all around us. The conveniences of the modern world — ubiquitous communication through Internet enabled phones, electronic payments, and digital streaming, to name just a few examples — are all due to continuous engineering innovations delivered through cheaper, faster, more precise electronics. Continue reading

Electrification – The Need for Optimizing Power, Performance and Cost

The electrification of our world continues at a rapid pace. Having established a strong footprint across the globe via communication technologies, the high tech industry is now forming alliances with automotive companies to make our cars smarter. You need look no further than the 2016 Consumer Electronics Show, where the automobile industry stole the show with their demonstrations of autonomous vehicles, which are moving ever closer to market. Continue reading

ANSYS Chip Package System Analysis Ready for the “Next Big Thing” in Mobile Design

Delivering a truly innovative product for the mobile revolution requires optimization at every level of design for power, performance, thermal and structural integrity. The success of today’s electronic products are tied to the success of their entire system, including all components from antenna to board, and from chip to chassis. Designing a smart watch, for example, requires multiple iterations of chip, package, board, antenna, and cooling strategy to arrive at a final optimized product. Continue reading

RedHawk 2014 Enables FinFET-Based Designs

image of ANSYS RedHawk GUIToday, I’m pleased to announce the launch of ANSYS Redhawk 2014. RedHawk was the industry’s first foundry-certified, full-chip sign-off solution for power noise and reliability. Over the past 10 years, its accuracy, performance and scalability benefits have enabled thousands of successful designs to make it into production by all major semiconductor companies. The newest version of the software will help to ensure that RedHawk continues to be a technology leader and solution of choice for chip designers around the world. Continue reading

What’s With All The Noise About FinFETs?

Power noise integrity challenges designers face in FinFET-based design

ReFinFET2cently, there has been a lot of talk around designing systems-on-chips (SoCs) using FinFET technology. So what is a FinFET and what’s all the noise about? Simply put, FinFET is a three-dimensional field-effect transistor (FET) where the gate is wrapped around an elevated channel, creating a “fin”. Compared to traditional planar MOS transistors, FinFET architecture offers reduced leakage power and increased drive current, resulting in lower power, higher performance SoCs for mobile, networking, computing, and other applications. Continue reading

Apache Design Acquisition Done Right

PrintTwo years ago, ANSYS, Inc. acquired Apache Design to broaden its presence in the IC-aware system simulation market, particularly for the high-growth mobile and consumer electronics segments. We had a vision of combining chip-level analysis and modeling solutions from Apache with package and systems electromagnetics, thermal/fluids and mechanical simulation platforms from ANSYS, to enable the next generation of low-power, energy-efficient products. We had also underscored our commitment toward customers’ success by providing continuous support and technology innovation. On our two-year anniversary, we reflect on the progress that we have made toward this vision.

Since the acquisition by ANSYS, Apache has achieved: Continue reading